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NVMD4N03R2G

Onsemi

NVMD4N03R2G by Onsemi

NVMD4N03R2G by Onsemi is an N-CHANNEL Power FET with 4A max drain current and 2W max power dissipation. Ideal for surface mount applications, it operates at up to 150°C making it suitable for various power management tasks in electronic devices.

Median Price

$1.360

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,480 parts In-Stock

1+ parts

$2.030

100+ parts

$0.873

1k+ parts

$0.633

10k+ parts

$0.563

2,480

$2.030

$0.873

$0.633

$0.563

DigiKey

USA . 2,359 parts In-Stock

1+ parts

$2.030

100+ parts

$0.872

1k+ parts

$0.633

10k+ parts

-

2,359

$2.030

$0.872

$0.633

-

Rochester

USA . 10,528 parts In-Stock

1+ parts

-

100+ parts

$0.664

1k+ parts

$0.551

10k+ parts

$0.492

10,528

-

$0.664

$0.551

$0.492

Verical

USA . 6,356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.689

10k+ parts

$0.615

6,356

-

-

$0.689

$0.615

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,406 parts In-Stock

1+ parts

$0.516

100+ parts

-

1k+ parts

-

10k+ parts

-

2,406

$0.516

-

-

-

Vyrian

USA . 1,354 parts In-Stock

1+ parts

$0.543

100+ parts

-

1k+ parts

-

10k+ parts

-

1,354

$0.543

-

-

-

Chip Stock

USA . 67,000 parts In-Stock

1+ parts

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67,000

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Flip Electronics

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

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30,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,307 parts In-Stock

1+ parts

$0.489

100+ parts

-

1k+ parts

-

10k+ parts

-

2,307

$0.489

-

-

-

Corohmni

South Africa . 366 parts In-Stock

1+ parts

$0.543

100+ parts

-

1k+ parts

-

10k+ parts

-

366

$0.543

-

-

-

Perfect Parts

USA . 13,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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13,440

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-

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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10,000

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QUARKTWIN TECHNOLOGY LTD

USA . 4,399 parts In-Stock

1+ parts

-

100+ parts

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4,399

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-

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SupplyDigital Components

Austria . 3,507 parts In-Stock

1+ parts

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100+ parts

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3,507

-

-

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TANS Electronics

Latvia . 3,043 parts In-Stock

1+ parts

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3,043

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Kulean Microsystems

USA . 2,745 parts In-Stock

1+ parts

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2,745

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UHIMA Technologies

Türkiye . 298 parts In-Stock

1+ parts

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298

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Problanco Electronics

Mexico . 44 parts In-Stock

1+ parts

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100+ parts

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44

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Overview

Unlock the power of innovation with the NVMD4N03R2G by Onsemi. As a leader in Power Field Effect Transistors, Onsemi delivers unparalleled quality and reliability in every product. Ideal for a wide range of applications, this N-CHANNEL FET offers customers a high-performance solution with a maximum drain current of 4A and a maximum power dissipation of 2W. Trust Onsemi to provide cutting-edge technology and superior performance, making the NVMD4N03R2G the ultimate choice for your power management needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for high power applications due to their ability to handle higher currents and voltages efficiently.

Surface Mount: YES

Surface mount FETs are compact and easy to install, making them ideal for space-constrained applications and automated assembly processes.

Maximum Drain Current (Abs): 4 A

With a high maximum drain current, this FET can handle heavier loads and provide better performance in demanding applications.

Maximum Power Dissipation (Abs): 2 W

The low power dissipation of 2 W ensures efficient operation and helps prevent overheating in the circuit.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer high input impedance, fast switching speeds, and low output capacitance, making them suitable for high-frequency applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without compromising performance or longevity.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term durability.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds minimizes thermal stress on the FET during soldering, reducing the risk of damage or failure.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable solder joints and ensures the FET can withstand the soldering process without degradation.

Technical Specifications

Power Field Effect Transistors (FET) NVMD4N03R2G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMD4N03R2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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