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NVD3055L170T4G

Onsemi

NVD3055L170T4G by Onsemi

NVD3055L170T4G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 27A IDM, and 0.17 ohm RDS(on). Ideal for SWITCHING applications in automotive (AEC-Q101) due to its 175 °C Max Operating Temp and 30mJ EAS.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 34,000 parts In-Stock

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Vyrian

USA . 5,358 parts In-Stock

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Digiode

USA . 2,280 parts In-Stock

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Sensible Micro Corp

USA . 806 parts In-Stock

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AZTECH Wire

Italy . 116 parts In-Stock

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$19.460

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Kepictronics

USA . 73,500 parts In-Stock

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Perfect Parts

USA . 21,661 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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RC Electronics

USA . 8,100 parts In-Stock

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TANS Electronics

Latvia . 7,764 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,740 parts In-Stock

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Corphita

USA . 2,102 parts In-Stock

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SupplyDigital Components

Austria . 1,693 parts In-Stock

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Problanco Electronics

Mexico . 1,531 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 526 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 120 parts In-Stock

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Overview

Unleash the power of innovation with the NVD3055L170T4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are designed for superior performance in switching applications. With a built-in diode and an enhancement mode operating mode, this N-channel transistor offers maximum efficiency and reliability. Its compact design and high operating temperature make it ideal for a wide range of applications. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the NVD3055L170T4G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

Offers efficient switching capabilities and low ON resistance, making it suitable for a variety of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode within the FET, reducing component count and improving overall efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast turn-on and turn-off times for optimal performance.

Surface Mount: YES

Facilitates easy installation on PCBs, saving space and allowing for automated manufacturing processes.

Minimum DS Breakdown Voltage: 60 V

Offers a high breakdown voltage, suitable for applications requiring reliable operation under high voltage conditions.

Package Shape: RECTANGULAR

Allows for compact and efficient PCB layout, maximizing space utilization in electronic devices.

Terminal Form: GULL WING

Enables secure and reliable solder connections during assembly, ensuring long-term performance in various environments.

Operating Mode: ENHANCEMENT MODE

Provides enhanced control over the transistor's operation, allowing for precise switching characteristics and improved efficiency.

Maximum Pulsed Drain Current (IDM): 27 A

Capable of handling high peak currents, suitable for applications with sudden load changes or transient conditions.

Avalanche Energy Rating (EAS): 30 mJ

Offers protection against high energy surges, ensuring the FET can withstand transient events without damage.

Maximum Drain Current (Abs) (ID): 9 A

Suitable for applications with moderate current requirements, providing reliable operation under normal operating conditions.

Maximum Power Dissipation (Abs): 28.5 W

Capable of dissipating heat efficiently, ensuring reliable operation even under high power conditions.

Package Style (Meter): SMALL OUTLINE

Offers a compact form factor, ideal for space-constrained applications without compromising performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides efficient performance with low gate capacitance and high switching speeds, ideal for high-frequency applications.

Maximum Operating Temperature: 175 °C

Capable of operating in elevated temperature environments, ensuring reliable performance in a wide range of operating conditions.

Transistor Element Material: SILICON

Offers high reliability and efficiency, ensuring long-term performance without degradation over time.

Terminal Finish: MATTE TIN

Provides excellent solderability and corrosion resistance, ensuring reliable electrical connections during assembly.

Maximum Drain-Source On Resistance: 0.17 ohm

Low ON resistance results in reduced power losses and improved efficiency during switching operations.

Case Connection: DRAIN

Simplifies circuit design and layout, ensuring proper connection and operation within the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for safe and reliable reflow soldering, ensuring proper assembly and connection of the FET during manufacturing.

Peak Reflow Temperature °C: 260

Suitable for lead-free soldering processes, ensuring compliance with environmental regulations and industry standards.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 automotive standard ensures high-quality and reliability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVD3055L170T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

30 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.17 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

27 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVD3055L170T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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