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NVB260N65S3

Onsemi

NVB260N65S3 by Onsemi

NVB260N65S3 by Onsemi is a N-CHANNEL FET with 650V DS breakdown voltage, 30A IDM, and 0.26 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with 90W power dissipation. Suitable for automotive use with AEC-Q101 standard compliance.

Median Price

$2.652

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 443 parts In-Stock

1+ parts

$3.940

100+ parts

$1.810

1k+ parts

$1.400

10k+ parts

-

443

$3.940

$1.810

$1.400

-

Chip1Stop

Japan . 610 parts In-Stock

1+ parts

$8.520

100+ parts

$3.660

1k+ parts

$2.680

10k+ parts

-

610

$8.520

$3.660

$2.680

-

Verical

USA . 7,161 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.363

10k+ parts

$1.275

7,161

-

-

$1.363

$1.275

Rochester

USA . 7,161 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.090

10k+ parts

$1.020

7,161

-

$1.220

$1.090

$1.020

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,069 parts In-Stock

1+ parts

$1.282

100+ parts

-

1k+ parts

-

10k+ parts

-

2,069

$1.282

-

-

-

Vyrian

USA . 637 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

-

637

$1.320

-

-

-

Chip Stock

USA . 20,000 parts In-Stock

1+ parts

-

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20,000

-

-

-

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Flip Electronics

USA . 6,400 parts In-Stock

1+ parts

-

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-

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6,400

-

-

-

-

NAC Semi

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.220

10k+ parts

$2.050

1,600

-

-

$2.220

$2.050

IBS Electronics

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.638

10k+ parts

$1.612

800

-

-

$1.638

$1.612

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 197 parts In-Stock

1+ parts

$1.215

100+ parts

-

1k+ parts

-

10k+ parts

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197

$1.215

-

-

-

Corohmni

South Africa . 486 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

-

486

$1.320

-

-

-

Microchip USA

USA . 307 parts In-Stock

1+ parts

$11.171

100+ parts

-

1k+ parts

-

10k+ parts

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307

$11.171

-

-

-

TANS Electronics

Latvia . 8,003 parts In-Stock

1+ parts

-

100+ parts

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8,003

-

-

-

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SupplyDigital Components

Austria . 7,595 parts In-Stock

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7,595

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Kulean Microsystems

USA . 4,300 parts In-Stock

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4,300

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Perfect Parts

USA . 3,203 parts In-Stock

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3,203

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Problanco Electronics

Mexico . 2,146 parts In-Stock

1+ parts

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2,146

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-

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GreenTree Electronics

Israel . 710 parts In-Stock

1+ parts

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710

-

-

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Authorized Procurement Solutions

USA . 630 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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630

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iodParts Technologies Inc.

India . 610 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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610

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UHIMA Technologies

Türkiye . 413 parts In-Stock

1+ parts

-

100+ parts

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413

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-

Overview

Discover the power of innovation with the NVB260N65S3 by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor (FET) offers unparalleled quality and performance in switching applications. With a built-in diode for added convenience, this transistor provides efficient operation and reliability. Ideal for a wide range of uses, from industrial to automotive, the NVB260N65S3 delivers exceptional value and benefits, making it the top choice for customers looking for cutting-edge technology. Experience the difference with Onsemi's NVB260N65S3 and unleash the potential of your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various environments and applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs have lower on-resistance and are ideal for high power applications, making this product efficient and effective.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the switching performance and protects the circuit from reverse voltage, making this product versatile and robust.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast and reliable switching performance in various electronic circuits.

Maximum Power Dissipation (Abs): 90 W

With a high power dissipation rating, this FET can handle large amounts of power without overheating, ensuring stable operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This advanced technology offers high efficiency, low gate drive power, and fast switching speeds, making this FET an excellent choice for power electronics.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand elevated temperatures, allowing it to operate reliably in demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) NVB260N65S3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

57 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.26 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVB260N65S3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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