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NVB25P06T4G

Onsemi

NVB25P06T4G by Onsemi

NVB25P06T4G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 80A IDM, 600mJ EAS, and 0.082 ohm RDS(ON). With a max power dissipation of 120W and operating temperature up to 175 °C, it's suitable for various high-power electronic designs.

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

$1.150

1k+ parts

$0.955

10k+ parts

$0.851

2,400

-

$1.150

$0.955

$0.851

Distributors (In-Stock)

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Digiode

USA . 1,384 parts In-Stock

1+ parts

$0.898

100+ parts

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1,384

$0.898

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Chip Stock

USA . 40,000 parts In-Stock

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40,000

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Vyrian

USA . 7,974 parts In-Stock

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7,974

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Flip Electronics

USA . 7,200 parts In-Stock

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7,200

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Distributors (Availability)

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Corphita

USA . 1,539 parts In-Stock

1+ parts

$0.850

100+ parts

-

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1,539

$0.850

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Corohmni

South Africa . 298 parts In-Stock

1+ parts

$0.945

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298

$0.945

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AZTECH Wire

Italy . 750 parts In-Stock

1+ parts

$21.360

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750

$21.360

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Problanco Electronics

Mexico . 2,653 parts In-Stock

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2,653

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TANS Electronics

Latvia . 2,345 parts In-Stock

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2,345

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Kulean Microsystems

USA . 2,185 parts In-Stock

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SupplyDigital Components

Austria . 1,320 parts In-Stock

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UHIMA Technologies

Türkiye . 223 parts In-Stock

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223

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Overview

Elevate your power management capabilities with the high-quality NVB25P06T4G Power FET by Onsemi. Designed for switching applications, this N-channel transistor offers enhanced performance and reliability. With a maximum pulsed drain current of 80A and a small outline package style, this transistor is ideal for a wide range of electronic devices. Trust in Onsemi's expertise in semiconductor technology to deliver a product that exceeds expectations. Upgrade your projects today with the NVB25P06T4G and experience the difference in efficiency and power handling.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have higher mobility and faster switching speeds compared to P-Channel FETs, making them ideal for applications requiring high performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage, enhancing the reliability of the FET operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in controlling the flow of power.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Drain-Source On Resistance: 0.082 ohm

Low on-resistance results in minimal power loss and improved efficiency in power delivery.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without sacrificing performance, suitable for demanding industrial environments.

Technical Specifications

Power Field Effect Transistors (FET) NVB25P06T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

600 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

27.5 A

Maximum Drain Current (ID):

27.5 A

Maximum Drain-Source On Resistance:

.082 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Reference Standard:

AEC-Q101

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVB25P06T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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