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NTS1260MFST1G

Onsemi

NTS1260MFST1G by Onsemi

NTS1260MFST1G by Onsemi is a Schottky rectifier diode with a max output current of 12A and forward voltage of 0.6V. It operates b/w -55 to 150 °C, ideal for efficiency applications. This single-configured diode has a max reverse current of 90uA and can handle up to 60V peak repetitive reverse voltage.

Median Price

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Lifecycle Status

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5

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1k+

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USA . 10,500 parts In-Stock

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USA . 10,500 parts In-Stock

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Advanced Electronics

New Zealand . 70 parts In-Stock

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AZTECH Wire

Italy . 949 parts In-Stock

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Mexico . 5,338 parts In-Stock

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Kulean Microsystems

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Latvia . 1,336 parts In-Stock

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Overview

Unlock unparalleled efficiency with the NTS1260MFST1G by Onsemi. Crafted with precision and expertise, this Schottky rectifier diode offers superior performance in a compact, single package design. Ideal for applications where maximum output current is crucial, this diode guarantees reliability and longevity even in extreme temperatures. Experience the difference with Onsemi's cutting-edge technology and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the diode, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and space.

Maximum Reverse Current: 90 uA

Low reverse current ensures efficiency and reliability in circuit operations.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement and space-saving on the PCB.

Maximum Operating Temperature: 150 °C

High operating temperature range ensures stability and reliability in various operating conditions.

Diode Type: RECTIFIER DIODE

Rectifier diode is suitable for converting AC to DC current, making it versatile for different applications.

Maximum Forward Voltage (VF): 0.6 V

Low forward voltage drop ensures minimal power loss and high efficiency in circuit operations.

Maximum Output Current: 12 A

High output current capacity allows for handling of high power loads with ease.

Technology: SCHOTTKY

Schottky diode technology ensures fast switching speed and low forward voltage drop for efficient circuit performance.

Maximum Repetitive Peak Reverse Voltage: 60 V

Suitable for applications requiring handling of moderate reverse voltage levels.

Technical Specifications

Diodes & Rectifiers NTS1260MFST1G attributes and parameters. Explore more Diodes & Rectifiers devices from Onsemi

Specs

Additional Features:

FREE WHEELING DIODE, LOW POWER LOSS

Application:

EFFICIENCY

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.6 V

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

210 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

5

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

12 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Repetitive Peak Reverse Voltage:

60 V

Maximum Reverse Current:

90 uA

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTS1260MFST1G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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