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NTQD6866T1

Onsemi

NTQD6866T1 by Onsemi

NTQD6866T1 by Onsemi is a N-CHANNEL FET with 2 elements and built-in diode, ideal for SWITCHING applications. It features a Max Drain Current of 4.3A, Max DS On Resistance of 0.032 ohm, and Min DS Breakdown Voltage of 20V. This small outline transistor has GULL WING terminals and operates in ENHANCEMENT MODE.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,436 parts In-Stock

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Vyrian

USA . 393 parts In-Stock

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SupplyDigital Components

Austria . 7,011 parts In-Stock

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Corphita

USA . 2,046 parts In-Stock

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Kulean Microsystems

USA . 1,473 parts In-Stock

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TANS Electronics

Latvia . 1,354 parts In-Stock

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Problanco Electronics

Mexico . 1,034 parts In-Stock

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UHIMA Technologies

Türkiye . 480 parts In-Stock

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Corohmni

South Africa . 235 parts In-Stock

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Overview

Enhance your electronic designs with the NTQD6866T1 by Onsemi, a high-quality small signal field effect transistor designed for switching applications. Built with precision and expertise by Onsemi, this N-channel transistor offers customers reliable performance and durability. With its innovative design featuring 2 separate elements with a built-in diode, this transistor provides value and efficiency. Whether you're creating consumer electronics, automotive systems, or industrial equipment, the NTQD6866T1 is the perfect solution for your project. Upgrade your designs today with Onsemi's exceptional field effect transistor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the inner components of the transistor, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are commonly used in electronic devices for better voltage control and efficiency.

Minimum DS Breakdown Voltage: 20 V

With a breakdown voltage of 20 V, this transistor can handle varying voltages without getting damaged.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can rapidly turn on and off, making it suitable for various electronic circuits.

No. of Elements: 2

Having 2 elements with built-in diode allows for more complex circuit configurations and versatile usage.

Maximum Drain Current (ID): 4.3 A

The high maximum drain current capacity enables this transistor to handle heavy loads and deliver reliable performance.

Maximum Drain-Source On Resistance: 0.032 ohm

Low drain-source on resistance results in minimal power loss and efficient operation of the transistor.

Maximum Feedback Capacitance (Crss): 175 pF

Low feedback capacitance helps in reducing signal distortion and improving the overall performance of the transistor in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTQD6866T1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

4.3 A

Maximum Drain-Source On Resistance:

.032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

175 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTQD6866T1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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