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NTQD6866R2

Onsemi

NTQD6866R2 by Onsemi

NTQD6866R2 by Onsemi is a N-CHANNEL FET with 20V DS breakdown voltage and 6.9A max drain current, ideal for switching applications. Featuring common drain configuration, it has 2 elements with built-in diode in a small outline package style. Operating in enhancement mode, this MOSFET has 0.032ohm max on resistance and can handle up to 0.78W power dissipation at 150 °C.

Median Price

$0.256

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,960 parts In-Stock

1+ parts

-

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$0.251

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$0.208

10k+ parts

$0.186

7,960

-

$0.251

$0.208

$0.186

Verical

USA . 7,960 parts In-Stock

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$0.260

7,960

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$0.260

Distributors (In-Stock)

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Digiode

USA . 737 parts In-Stock

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$0.196

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737

$0.196

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Vyrian

USA . 7,419 parts In-Stock

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Corphita

USA . 478 parts In-Stock

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$0.185

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478

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Corohmni

South Africa . 112 parts In-Stock

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$0.206

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112

$0.206

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AZTECH Wire

Italy . 1,217 parts In-Stock

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$13.100

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$13.100

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QUARKTWIN TECHNOLOGY LTD

USA . 29,926 parts In-Stock

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Continental Prestige Electronics

USA . 7,960 parts In-Stock

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$0.200

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7,960

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$0.200

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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TANS Electronics

Latvia . 6,648 parts In-Stock

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Kulean Microsystems

USA . 5,991 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,525 parts In-Stock

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Problanco Electronics

Mexico . 5,339 parts In-Stock

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SupplyDigital Components

Austria . 4,147 parts In-Stock

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Metaverse IC Inc.

Canada . 1,276 parts In-Stock

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UHIMA Technologies

Türkiye . 817 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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Overview

Upgrade your electronics with the NTQD6866R2 by Onsemi, a high-quality small signal field effect transistor that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-channel transistor is designed for switching applications with a common drain configuration and built-in diode elements. With a maximum drain current of 6.9A and a low drain-source on resistance of 0.032 ohm, this transistor provides efficient power management and enhanced functionality. Whether you're a hobbyist or a professional, the NTQD6866R2 is the perfect choice for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow, making it suitable for a variety of applications.

Minimum DS Breakdown Voltage: 20 V

Can handle moderate voltage levels, making it versatile for different circuit requirements.

Operating Mode: ENHANCEMENT MODE

Allows for easy control and modulation of the transistor's conductivity.

Maximum Drain Current (Abs) (ID): 6.9 A

Provides high current capability, suitable for demanding applications.

Maximum Power Dissipation (Abs): 0.78 W

Efficient power handling capacity without risking overheating.

Maximum Operating Temperature: 150 °C

Can operate in higher temperature environments without performance degradation.

Maximum Drain-Source On Resistance: 0.032 ohm

Low resistance leads to minimal power wastage and efficient switching.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTQD6866R2 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE, AVALANCHE RATED

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

6.9 A

Maximum Drain Current (ID):

4.7 A

Maximum Drain-Source On Resistance:

.032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

175 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTQD6866R2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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