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NTP70N08

Onsemi

NTP70N08 by Onsemi

NTP70N08 by Onsemi is a single N-channel power FET with 80V DS breakdown voltage. It is used for switching applications in enhancement mode. The transistor features a plastic/epoxy package, rectangular shape, and through-hole terminals for easy installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 376 parts In-Stock

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Vyrian

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SupplyDigital Components

Austria . 8,304 parts In-Stock

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Problanco Electronics

Mexico . 3,610 parts In-Stock

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TANS Electronics

Latvia . 2,674 parts In-Stock

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Corphita

USA . 1,587 parts In-Stock

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Kulean Microsystems

USA . 1,219 parts In-Stock

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UHIMA Technologies

Türkiye . 511 parts In-Stock

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Corohmni

South Africa . 243 parts In-Stock

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Overview

Unlock the power of innovation with the NTP70N08 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that guarantee reliability and performance. Ideal for switching applications, this N-CHANNEL transistor boasts a minimum DS Breakdown Voltage of 80V, making it perfect for a wide range of projects. With a single configuration and enhancement mode operation, the NTP70N08 offers unparalleled value and benefits to customers looking for high-quality components. Upgrade your designs with Onsemi's cutting-edge technology and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components, ensuring a longer lifespan for the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer higher electron mobility and faster switching speeds, making them ideal for high-performance applications.

Configuration: SINGLE

A single configuration simplifies circuit design and reduces the complexity of the overall system, making it easier to integrate into existing systems.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can rapidly turn on and off, making it ideal for power management and control.

Minimum DS Breakdown Voltage: 80 V

With a minimum breakdown voltage of 80V, this transistor can handle higher voltages, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and placement on a circuit board, optimizing space and improving thermal performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection, ensuring stable operation in various environmental conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer precise control over the switch, allowing for efficient power management and improved performance.

No. of Terminals: 3

With 3 terminals, this transistor offers flexibility in circuit design and can be easily integrated into various electronic systems.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides mechanical stability and easy installation, making it suitable for industrial applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability, low power consumption, and fast operation, making it ideal for power management applications.

Transistor Element Material: SILICON

Silicon transistors offer high switching speeds, low on-resistance, and excellent thermal stability, ensuring reliable performance in demanding applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides a reliable electrical connection and solderability, ensuring long-term performance and durability.

Terminal Position: SINGLE

A single terminal position simplifies circuit design and installation, making it easier to integrate into various electronic systems.

Case Connection: DRAIN

The drain connection allows for efficient heat dissipation and thermal management, ensuring reliable performance in high power applications.

Technical Specifications

Power Field Effect Transistors (FET) NTP70N08 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

80 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP70N08 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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