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NTP75N03R

Onsemi

NTP75N03R by Onsemi

NTP75N03R by Onsemi is a Power FET with N-CHANNEL polarity, 25V DS Breakdown Voltage, and 225A IDM. Ideal for SWITCHING applications due to 0.013 ohm Drain-Source Resistance, 74.4W Power Dissipation, and 150 °C Operating Temperature. Package: PLASTIC/EPOXY RECTANGULAR with THROUGH-HOLE terminals.

Median Price

$0.727

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,917 parts In-Stock

1+ parts

-

100+ parts

$0.700

1k+ parts

$0.581

10k+ parts

$0.518

2,917

-

$0.700

$0.581

$0.518

DigiKey

USA . 2,917 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.880

10k+ parts

-

2,917

-

-

$0.880

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Verical

USA . 2,917 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.727

10k+ parts

$0.648

2,917

-

-

$0.727

$0.648

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,339 parts In-Stock

1+ parts

$0.545

100+ parts

-

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2,339

$0.545

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Vyrian

USA . 2,365 parts In-Stock

1+ parts

$0.574

100+ parts

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2,365

$0.574

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,657 parts In-Stock

1+ parts

$0.517

100+ parts

-

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1,657

$0.517

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Corohmni

South Africa . 396 parts In-Stock

1+ parts

$0.574

100+ parts

-

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396

$0.574

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Microchip USA

USA . 4,936 parts In-Stock

1+ parts

$3.575

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4,936

$3.575

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Kulean Microsystems

USA . 7,364 parts In-Stock

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7,364

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TANS Electronics

Latvia . 6,681 parts In-Stock

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6,681

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Problanco Electronics

Mexico . 3,680 parts In-Stock

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3,680

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Continental Prestige Electronics

USA . 2,917 parts In-Stock

1+ parts

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100+ parts

$0.527

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2,917

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$0.527

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SupplyDigital Components

Austria . 2,244 parts In-Stock

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2,244

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A-Z Elektronik GmbH

Germany . 1,515 parts In-Stock

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1,515

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UHIMA Technologies

Türkiye . 617 parts In-Stock

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617

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Overview

Experience the power of the NTP75N03R by Onsemi, a high-quality Power Field Effect Transistor designed for efficient switching applications. With Onsemi's reputable manufacturing standards, this N-CHANNEL transistor offers reliability and performance. Whether you're looking to optimize your power management system or enhance your circuit design, the NTP75N03R provides value with its built-in diode, high operating temperature, and low on-resistance. Trust Onsemi's expertise and elevate your projects with the NTP75N03R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer high efficiency and fast switching speeds, making them ideal for power applications.

Minimum DS Breakdown Voltage: 25 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and increases efficiency by reducing voltage spikes.

Maximum Pulsed Drain Current (IDM): 225 A

The high pulsed drain current rating allows the FET to handle large currents during short pulses, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 74.4 W

The high power dissipation rating ensures the FET can handle high power levels without overheating, increasing its reliability.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand harsh environments and high temperature conditions.

Maximum Drain-Source On Resistance: 0.013 ohm

The low on-resistance of the FET results in lower conduction losses and higher efficiency in power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTP75N03R attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

71.7 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

9.7 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

225 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP75N03R Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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