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NTP70N08L

Onsemi

NTP70N08L by Onsemi

NTP70N08L by Onsemi is a single N-channel power FET with 80V DS breakdown voltage. It is used for switching applications, featuring an enhancement mode operation and metal-oxide semiconductor technology. The transistor comes in a rectangular package with through-hole terminals and drain case connection.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,492 parts In-Stock

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Digiode

USA . 284 parts In-Stock

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Problanco Electronics

Mexico . 7,466 parts In-Stock

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7,466

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Kulean Microsystems

USA . 5,970 parts In-Stock

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TANS Electronics

Latvia . 1,995 parts In-Stock

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Corphita

USA . 1,427 parts In-Stock

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UHIMA Technologies

Türkiye . 938 parts In-Stock

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938

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SupplyDigital Components

Austria . 630 parts In-Stock

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Corohmni

South Africa . 390 parts In-Stock

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Overview

Unlock the power of efficiency with the NTP70N08L by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for various switching applications. With its single configuration and enhancement mode operation, this transistor offers unparalleled performance and reliability. Say goodbye to inefficiency and hello to seamless power management with the NTP70N08L - the ultimate solution for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides a durable and lightweight housing for the transistor, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher switching speeds compared to P-channel FETs, making them ideal for high-performance switching applications.

Configuration: SINGLE

The single configuration simplifies circuit design and PCB layout, making installation easier for engineers and technicians.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for efficiency and reliability in high-speed switching circuits.

Minimum DS Breakdown Voltage: 80 V

The high breakdown voltage of 80 V allows the transistor to handle higher voltages without failure, increasing the overall robustness and longevity of the device.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor for easy integration into a variety of circuit designs and layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals are ideal for secure solder connections on a PCB, ensuring reliable electrical connections and mechanical stability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer fast switching speeds and low ON resistance, making them suitable for high-frequency and high-power applications.

No. of Terminals: 3

With three terminals, this FET is easy to interface with external circuitry and allows for flexible control in a range of applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers mechanical stability and heat dissipation, making it suitable for high-power applications where thermal management is critical.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making it ideal for power management and amplification applications.

Transistor Element Material: SILICON

Silicon-based transistors are known for their reliability, high performance, and compatibility with a wide range of operating conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent solderability and corrosion resistance, ensuring a durable and reliable connection in various operating environments.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation process and ensures consistent electrical connections for optimal performance.

Case Connection: DRAIN

The drain connection allows for efficient current flow and voltage control, essential for proper functioning in switch and amplification circuits.

Technical Specifications

Power Field Effect Transistors (FET) NTP70N08L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

80 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP70N08L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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