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NTP2955G

Onsemi

NTP2955G by Onsemi

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 62.5 W; Transistor Element Material: SILICON; Package Body Material: PLASTIC/EPOXY;

Median Price

$0.620

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Future Electronics

Canada . 3 parts In-Stock

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$0.575

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$0.560

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$0.535

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$0.510

3

$0.575

$0.560

$0.535

$0.510

RS (Exports)

UK . 5 parts In-Stock

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$0.664

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$0.615

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Nova Conductors

Japan . 150 parts In-Stock

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$0.536

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Digiode

USA . 2,121 parts In-Stock

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Maritex

Poland . 1,871 parts In-Stock

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$0.655

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$0.367

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$0.318

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Vyrian

USA . 7,401 parts In-Stock

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Holdelec - ElecDif-Pro

France . 590 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 590 parts In-Stock

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ComSIT Distribution GmbH

Germany . 350 parts In-Stock

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Bristol Electronics

USA . 78 parts In-Stock

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Atlantic Semiconductor

USA . 78 parts In-Stock

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North Shore Components

USA . 46 parts In-Stock

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Pegasus Components GmbH

Germany . 44 parts In-Stock

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PC Components Company LLC

USA . 15 parts In-Stock

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Prism Electronics

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Corphita

USA . 404 parts In-Stock

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$0.518

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$0.518

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Corohmni

South Africa . 149 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$0.536

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$0.525

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Component Stockers USA

USA . 9 parts In-Stock

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$0.640

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Ampacity Inc.

Singapore . 4 parts In-Stock

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$1.060

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AZTECH Wire

Italy . 276 parts In-Stock

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$9.499

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Kepictronics

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Problanco Electronics

Mexico . 7,695 parts In-Stock

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SupplyDigital Components

Austria . 7,179 parts In-Stock

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Microchip USA

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Kulean Microsystems

USA . 4,155 parts In-Stock

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Argo Parts USA

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TANS Electronics

Latvia . 1,145 parts In-Stock

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UHIMA Technologies

Türkiye . 694 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 350 parts In-Stock

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Technical Specifications

Power Field Effect Transistors (FET) NTP2955G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

216 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

2.4 A

Maximum Drain-Source On Resistance:

.196 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

42 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP2955G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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