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NTP22N06L

Onsemi

NTP22N06L by Onsemi

NTP22N06L by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 66A IDM, and 0.065 ohm RDS. Ideal for SWITCHING applications due to its 175 °C Max Temp and 72 mJ EAS rating. Package: PLASTIC/EPOXY, RECTANGULAR shape with THROUGH-HOLE terminals.

Median Price

$0.132

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,246 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

3,246

-

$0.132

$0.110

$0.098

Distributors (In-Stock)

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Digiode

USA . 1,497 parts In-Stock

1+ parts

$0.103

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1,497

$0.103

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Vyrian

USA . 6,725 parts In-Stock

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6,725

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Distributors (Availability)

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Corphita

USA . 1,479 parts In-Stock

1+ parts

$0.097

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1,479

$0.097

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Corohmni

South Africa . 107 parts In-Stock

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$0.108

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107

$0.108

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AZTECH Wire

Italy . 575 parts In-Stock

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$14.590

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575

$14.590

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Kepictronics

USA . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 6,554 parts In-Stock

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SupplyDigital Components

Austria . 4,033 parts In-Stock

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4,033

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,246 parts In-Stock

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$0.099

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3,246

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$0.099

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TANS Electronics

Latvia . 1,160 parts In-Stock

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Kulean Microsystems

USA . 976 parts In-Stock

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976

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UHIMA Technologies

Türkiye . 856 parts In-Stock

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Overview

Experience the superior performance of the NTP22N06L Power Field Effect Transistor by Onsemi. With a focus on quality and innovation, Onsemi delivers cutting-edge technology in a package that is built to last. Perfect for switching applications, this N-channel transistor boasts a high breakdown voltage and impressive power dissipation capabilities. Whether you're looking to enhance your circuit design or improve efficiency, the NTP22N06L offers unmatched value and reliability. Trust Onsemi to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring longevity and ease of handling.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher electron mobility, making them ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from voltage spikes, improving reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers efficient and fast switching operation.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage provides protection against voltage surges, ensuring safe and reliable operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and efficient use of space in circuit boards.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide a secure and reliable connection in electronic circuits.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and offer better efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 66 A

The high pulsed drain current rating allows the FET to handle short bursts of high current, making it suitable for power applications.

Avalanche Energy Rating (EAS): 72 mJ

The high avalanche energy rating ensures the FET can withstand transient voltage spikes without damage.

Maximum Power Dissipation (Abs): 60 W

With a high power dissipation rating, this FET can handle high power levels without overheating, ensuring reliability.

Maximum Drain-Source On Resistance: 0.065 ohm

The low on-resistance of the FET minimizes power loss and heat generation during operation, improving efficiency.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature rating ensures the FET can operate reliably in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and electrical conductivity, ensuring reliable connections in circuits.

Case Connection: DRAIN

The drain connection simplifies the circuit layout and enhances the thermal performance of the FET.

Peak Reflow Temperature °C: 235

The high peak reflow temperature allows for easy and reliable soldering during manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) NTP22N06L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

72 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

66 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP22N06L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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