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NTP22N06

Onsemi

NTP22N06 by Onsemi

NTP22N06 by Onsemi is a Power FET with 60V DS Breakdown Voltage, 66A IDM, and 0.06 ohm RDS(on). It is an N-CHANNEL transistor for SWITCHING applications. The device has a max power dissipation of 60W and operates in ENHANCEMENT MODE at up to 175 °C.

Median Price

$0.121

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5,520 parts In-Stock

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$0.110

5,520

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$0.110

Rochester

USA . 333 parts In-Stock

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-

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$0.132

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$0.110

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$0.098

333

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$0.132

$0.110

$0.098

Distributors (In-Stock)

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Digiode

USA . 222 parts In-Stock

1+ parts

$0.103

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222

$0.103

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Vyrian

USA . 1,090 parts In-Stock

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$0.108

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$0.108

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Distributors (Availability)

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Corphita

USA . 1,286 parts In-Stock

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$0.097

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1,286

$0.097

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Corohmni

South Africa . 172 parts In-Stock

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$0.108

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172

$0.108

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Component Stockers USA

USA . 6,493 parts In-Stock

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$0.110

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$0.100

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$0.090

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-

6,493

$0.110

$0.100

$0.090

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Kepictronics

USA . 13,000 parts In-Stock

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TANS Electronics

Latvia . 7,804 parts In-Stock

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SupplyDigital Components

Austria . 6,944 parts In-Stock

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Continental Prestige Electronics

USA . 5,520 parts In-Stock

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$0.099

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5,520

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$0.099

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Problanco Electronics

Mexico . 3,148 parts In-Stock

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Kulean Microsystems

USA . 3,078 parts In-Stock

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UHIMA Technologies

Türkiye . 295 parts In-Stock

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Overview

Upgrade your power management system with the NTP22N06 from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors (FET). Ideal for switching applications, this N-channel transistor offers enhanced performance and efficiency. With a maximum drain current of 22 A and a low on-resistance of just 0.06 ohm, this transistor provides exceptional value and benefits to customers looking for high-power solutions. Trust Onsemi to power up your projects with cutting-edge technology and superior performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the transistor, making it suitable for use in various environments.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically offer better performance and efficiency compared to P-Channel transistors, making this product a good choice for power applications.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this transistor can handle higher voltage levels without failure, ensuring reliable operation in power applications.

Maximum Pulsed Drain Current (IDM): 66 A

The high pulsed drain current rating of 66A allows this transistor to handle surges in current, making it suitable for switching applications that require high current capabilities.

Maximum Power Dissipation (Abs): 60 W

With a maximum power dissipation of 60W, this transistor can efficiently dissipate heat generated during operation, ensuring reliability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide semiconductor technology offers high switching speeds and low power consumption, making this transistor ideal for high-performance switching applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this transistor can operate in high-temperature environments without compromising performance, increasing its versatility.

Maximum Drain-Source On Resistance: 0.06 ohm

The low drain-source on resistance of 0.06 ohm minimizes power loss and improves efficiency, making this transistor an excellent choice for power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTP22N06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

72 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

66 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP22N06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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