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NTMT185N60S5H

Onsemi

NTMT185N60S5H by Onsemi

NTMT185N60S5H by Onsemi is a N-CHANNEL FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. It features 53A IDM and 124mJ EAS, operating in ENHANCEMENT MODE. With a max power dissipation of 116W and -55 to 150 °C operating temperature range, it offers reliable performance in various electronic systems.

Median Price

$2.050

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 51,565 parts In-Stock

1+ parts

-

100+ parts

$2.050

1k+ parts

$1.840

10k+ parts

$1.730

51,565

-

$2.050

$1.840

$1.730

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,413 parts In-Stock

1+ parts

$2.166

100+ parts

-

1k+ parts

-

10k+ parts

-

2,413

$2.166

-

-

-

Vyrian

USA . 8,177 parts In-Stock

1+ parts

-

100+ parts

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8,177

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-

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Flip Electronics

USA . 3,000 parts In-Stock

1+ parts

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3,000

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-

-

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Sensible Micro Corp

USA . 300 parts In-Stock

1+ parts

-

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1k+ parts

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300

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-

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-

Distributors (Availability)

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Corphita

USA . 506 parts In-Stock

1+ parts

$2.052

100+ parts

-

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-

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-

506

$2.052

-

-

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Corohmni

South Africa . 457 parts In-Stock

1+ parts

$2.280

100+ parts

-

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-

10k+ parts

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457

$2.280

-

-

-

AZTECH Wire

Italy . 1,109 parts In-Stock

1+ parts

$8.150

100+ parts

-

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1,109

$8.150

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Microchip USA

USA . 6,718 parts In-Stock

1+ parts

$15.072

100+ parts

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6,718

$15.072

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Problanco Electronics

Mexico . 7,885 parts In-Stock

1+ parts

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7,885

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Kulean Microsystems

USA . 7,023 parts In-Stock

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7,023

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TANS Electronics

Latvia . 3,339 parts In-Stock

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3,339

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UHIMA Technologies

Türkiye . 576 parts In-Stock

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576

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SupplyDigital Components

Austria . 450 parts In-Stock

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450

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Overview

Unleash the power of innovation with the NTMT185N60S5H from Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are ideal for a wide range of applications. With its N-CHANNEL configuration and built-in diode, this transistor is perfect for switching operations. Enjoy the benefits of enhanced performance, reliability, and efficiency with this product. Trust Onsemi to provide you with cutting-edge technology that will elevate your projects to new heights. Choose the NTMT185N60S5H for unparalleled value and advantages that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in reducing the overall weight of the transistor, making it easier to handle and install.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better conductivity and lower on-resistance compared to P-channel FETs, making this product more efficient in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the circuit against reverse current flow, increasing the reliability of the switching operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast and efficient operation, making it suitable for various electronic devices.

Surface Mount: YES

Being surface-mountable, this FET can be easily integrated onto PCBs, saving space and allowing for automated assembly processes.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle higher voltages, making it suitable for applications requiring high power levels.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the mounting process and reduces the risk of solder joint failures, enhancing the overall reliability of the product.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the switching operation, providing higher efficiency and faster response times in applications.

Maximum Pulsed Drain Current (IDM): 53 A

With a high pulsed drain current rating, this FET can handle sudden spikes in current, making it suitable for applications with high peak power requirements.

Avalanche Energy Rating (EAS): 124 mJ

The high avalanche energy rating indicates the ability of this FET to withstand voltage spikes and transient events, ensuring long-term reliability in harsh operating conditions.

No. of Terminals: 8

Having 8 terminals allows for more connection options and flexibility in circuit design, accommodating a wider range of applications.

Maximum Power Dissipation (Abs): 116 W

With a high power dissipation rating, this FET can handle significant power levels without overheating, ensuring reliable operation under high load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices or densely populated circuit boards.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology ensures high performance, low power consumption, and fast switching speeds, making this FET a reliable choice for various applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without degradation, ensuring stable performance in harsh environments.

Transistor Element Material: SILICON

Silicon-based transistors offer excellent thermal stability and reliability, making this product suitable for demanding applications requiring consistent performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows this FET to operate in cold environments without compromising performance, making it versatile for a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish prevents oxidation and ensures secure solder connections, enhancing the durability and reliability of the product.

Maximum Drain Current (ID): 15 A

With a high drain current rating, this FET can handle significant currents without overheating, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.185 ohm

The low drain-source on-resistance results in lower power losses and higher efficiency in switching operations, making this FET ideal for high-performance applications.

Terminal Position: DUAL

Having dual terminal positions provides additional flexibility in circuit layout and connection options, enhancing the versatility of this FET for various applications.

Case Connection: DRAIN

The drain case connection simplifies the circuit design and improves heat dissipation, ensuring reliable operation under high-power conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature indicates the robustness of this FET to withstand the reflow soldering process, ensuring secure and reliable solder joints.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this FET can withstand the reflow soldering process without degrading, ensuring consistent performance during assembly.

Technical Specifications

Power Field Effect Transistors (FET) NTMT185N60S5H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

124 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.185 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

53 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMT185N60S5H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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