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NTB18N06T4G

Onsemi

NTB18N06T4G by Onsemi

NTB18N06T4G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 45A IDM, and 0.09 ohm RDS(ON). Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation. Package: PLASTIC/EPOXY, GULL WING terminals, and 175 °C Max Temp make it suitable for various power electronics designs.

Median Price

$1.307

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,082 parts In-Stock

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Microfarads

USA . 756 parts In-Stock

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Digiode

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Bristol Electronics

USA . 100 parts In-Stock

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$1.307

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AZTECH Wire

Italy . 1,015 parts In-Stock

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$17.750

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Component Stockers USA

USA . 205 parts In-Stock

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$99.990

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,339 parts In-Stock

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Kepictronics

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Problanco Electronics

Mexico . 7,469 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Kulean Microsystems

USA . 3,791 parts In-Stock

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SupplyDigital Components

Austria . 3,528 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 1,392 parts In-Stock

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Futuretech Components

Singapore . 750 parts In-Stock

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UHIMA Technologies

Türkiye . 478 parts In-Stock

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Corohmni

South Africa . 403 parts In-Stock

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Overview

Experience the superior performance and reliability of the NTB18N06T4G by Onsemi, a leading manufacturer in the industry. This Power FET is designed for switching applications with a built-in diode, offering seamless operation and efficiency. With a high DS breakdown voltage of 60V and a maximum pulsing drain current of 45A, this transistor ensures optimal power handling capabilities. Its small outline package and single terminal form make it easy to integrate into various systems. Trust the NTB18N06T4G to deliver exceptional quality and functionality for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the transistor lightweight and durable, ideal for portable and long-lasting applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their fast switching speeds and high efficiency, making this transistor suitable for applications where performance is crucial.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, enhancing the overall reliability of the transistor in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers high efficiency and fast switching speeds, making it well-suited for power control and conversion tasks.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this transistor can handle higher voltage levels, making it suitable for a wide range of power applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact form factor, allowing for efficient use of space in electronic designs.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and ensures a secure connection, enhancing the reliability of the transistor in various operating conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer easy control of the device through gate voltage, providing flexibility and precise switching characteristics in various applications.

Maximum Pulsed Drain Current (IDM): 45 A

The high maximum pulsed drain current rating of 45A allows for reliable operation under transient load conditions, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 61 mJ

The high avalanche energy rating of 61mJ ensures robustness against voltage spikes and transient events, enhancing the overall reliability of the transistor.

Maximum Drain Current (Abs) (ID): 15 A

With a maximum drain current rating of 15A, this transistor can handle moderate power levels, making it suitable for a wide range of applications.

No. of Terminals: 2

Having only 2 terminals simplifies the circuit design and reduces the chances of wiring errors, making it easier to integrate into various electronic systems.

Maximum Power Dissipation (Abs): 48.4 W

The high maximum power dissipation rating of 48.4W allows for efficient heat dissipation, ensuring reliable operation under high load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for denser board designs, ideal for applications with space constraints.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency, low power consumption, and fast switching speeds, making this transistor suitable for power-sensitive applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature of 175 °C, this transistor can withstand elevated temperatures, making it suitable for high-temperature environments and industrial applications.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and performance, ensuring stable operation of the transistor over a wide temperature range.

Terminal Finish: TIN

The tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection and long-term performance of the transistor.

Maximum Drain-Source On Resistance: 0.09 ohm

The low drain-source on resistance of 0.09 ohm minimizes power losses and improves efficiency in power switching applications, making this transistor an energy-efficient choice.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation and connection process, ensuring ease of use and reducing the likelihood of wiring errors.

Case Connection: DRAIN

The drain case connection simplifies the circuit layout and allows for easy heat dissipation, enhancing the overall thermal performance of the transistor.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260 °C, this transistor can withstand the soldering process without damage, ensuring reliable and consistent solder joints during assembly.

Technical Specifications

Power Field Effect Transistors (FET) NTB18N06T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

61 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB18N06T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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