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NP2300GBRLG

Onsemi

NP2300GBRLG by Onsemi

NP2300GBRLG by Onsemi is a single silicon surge protector with 2 wire terminals. It has a max breakdown voltage of 260V and can handle up to 150000mA holding current. Ideal for applications requiring protection against surges in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,184 parts In-Stock

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2,184

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Digiode

USA . 1,440 parts In-Stock

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1,440

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,577 parts In-Stock

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7,577

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Problanco Electronics

Mexico . 7,029 parts In-Stock

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7,029

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TANS Electronics

Latvia . 6,595 parts In-Stock

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6,595

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SupplyDigital Components

Austria . 4,153 parts In-Stock

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4,153

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Corphita

USA . 2,080 parts In-Stock

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2,080

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UHIMA Technologies

Türkiye . 984 parts In-Stock

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984

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Corohmni

South Africa . 271 parts In-Stock

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271

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Overview

Protect your valuable electronics with the NP2300GBRLG surge protector from Onsemi. As a leader in semiconductor technology, Onsemi ensures top-quality products that provide reliable protection against electrical surges. Ideal for a wide range of applications, this silicon surge protector offers peace of mind and security for your devices. Trust Onsemi to deliver exceptional value, benefits, and advantages with the NP2300GBRLG surge protector.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection against external elements, ensuring a longer lifespan for the surge protector.

Configuration: SINGLE

The single configuration makes it easier to install and maintain the surge protector, simplifying the setup process.

Package Shape: ROUND

The round shape allows for easy mounting in various locations, providing flexibility in installation options.

Terminal Form: WIRE

The wire terminal form offers a secure and reliable connection, ensuring proper functioning of the surge protector.

No. of Terminals: 2

Having 2 terminals simplifies the installation process and provides a straightforward way to connect the surge protector to the power source.

Package Style (Meter): LONG FORM

The long form package style allows for better heat dissipation, ensuring optimal performance even under high surge conditions.

Maximum DC Off-state Voltage: 190 V

With a maximum DC off-state voltage of 190V, this surge protector can effectively handle surges and spikes within this voltage range to protect your devices.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The thyristor surge protector offers fast response times and high surge handling capacity, making it a reliable choice for protecting your electronic equipment.

Terminal Position: AXIAL

The axial terminal position allows for easy connection and ensures a secure fit, reducing the risk of accidental disconnection.

Case Connection: ISOLATED

The isolated case connection provides enhanced safety by isolating the surge protector from the power source, minimizing the risk of electrical hazards.

Maximum Holding Current: 150000 mA

With a maximum holding current of 150,000 mA, this surge protector can effectively handle high surge currents, offering reliable protection for your devices.

Maximum Breakdown Voltage: 260 V

The maximum breakdown voltage of 260V ensures that the surge protector can withstand voltage spikes and surges up to this level, safeguarding your equipment from damage.

Reference Standard: UL RECOGNIZED

Being UL recognized ensures that this surge protector meets the necessary safety and quality standards, providing peace of mind for the user.

Technical Specifications

Silicon Surge Protectors NP2300GBRLG attributes and parameters. Explore more Silicon Surge Protectors devices from Onsemi

Specs

Maximum Breakdown Voltage:

260 V

Case Connection:

Configuration:

Maximum DC Off-state Voltage:

190 V

Maximum Holding Current:

150000 mA

JEDEC-95 Code:

DO-15

JESD-30 Code:

O-PALF-W2

No. of Elements:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

WIRE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

NP2300GBRLG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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