Loading...

NLVHCT244ADTR2G

Onsemi

NLVHCT244ADTR2G by Onsemi

NLVHCT244ADTR2G by Onsemi is a 4-bit bus driver with 30ns propagation delay at 5V. It features dual ports, 3-STATE output, and AEC-Q100 screening. Ideal for military applications requiring CMOS technology in small outline packages.

Median Price

$0.898

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,511 parts In-Stock

1+ parts

$1.390

100+ parts

$0.550

1k+ parts

$0.383

10k+ parts

$0.300

4,511

$1.390

$0.550

$0.383

$0.300

Chip1Stop

Japan . 1,290 parts In-Stock

1+ parts

$2.910

100+ parts

$0.967

1k+ parts

$0.628

10k+ parts

-

1,290

$2.910

$0.967

$0.628

-

Rochester

USA . 1,488 parts In-Stock

1+ parts

-

100+ parts

$0.391

1k+ parts

$0.325

10k+ parts

$0.290

1,488

-

$0.391

$0.325

$0.290

Verical

USA . 1,448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.406

10k+ parts

$0.362

1,448

-

-

$0.406

$0.362

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,174 parts In-Stock

1+ parts

$0.243

100+ parts

-

1k+ parts

-

10k+ parts

-

1,174

$0.243

-

-

-

Digiode

USA . 642 parts In-Stock

1+ parts

$0.305

100+ parts

-

1k+ parts

-

10k+ parts

-

642

$0.305

-

-

-

Flip Electronics

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

45,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 155 parts In-Stock

1+ parts

$0.243

100+ parts

-

1k+ parts

-

10k+ parts

-

155

$0.243

-

-

-

Corphita

USA . 1,724 parts In-Stock

1+ parts

$0.289

100+ parts

-

1k+ parts

-

10k+ parts

-

1,724

$0.289

-

-

-

Component Stockers USA

USA . 4,696 parts In-Stock

1+ parts

$0.330

100+ parts

$0.310

1k+ parts

$0.280

10k+ parts

-

4,696

$0.330

$0.310

$0.280

-

Vigor

Singapore . 350 parts In-Stock

1+ parts

$0.870

100+ parts

-

1k+ parts

-

10k+ parts

-

350

$0.870

-

-

-

Microchip USA

USA . 3,792 parts In-Stock

1+ parts

$5.980

100+ parts

-

1k+ parts

-

10k+ parts

-

3,792

$5.980

-

-

-

Perfect Parts

USA . 26,578 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,578

-

-

-

-

Kulean Microsystems

USA . 8,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,006

-

-

-

-

Problanco Electronics

Mexico . 5,493 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,493

-

-

-

-

Infinite Electronics LLP (Excess)

. 4,781 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,781

-

-

-

-

SupplyDigital Components

Austria . 3,128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,128

-

-

-

-

Continental Prestige Electronics

USA . 1,488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.390

10k+ parts

-

1,488

-

-

$0.390

-

TANS Electronics

Latvia . 1,231 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,231

-

-

-

-

UHIMA Technologies

Türkiye . 225 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

225

-

-

-

-

Overview

Enhance your electronic designs with the NLVHCT244ADTR2G by Onsemi, a top-quality bus driver & transceiver perfect for a wide range of applications. With a military-grade screening level and advanced CMOS technology, this product offers superior performance and reliability. Experience fast propagation delay, 3-state output characteristics, and a compact design that fits seamlessly into any project. Trust in Onsemi's reputation for excellence and innovation to bring value and efficiency to your projects. Upgrade your designs today with the NLVHCT244ADTR2G and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability, making the product suitable for long-term use.

Propagation Delay At Nominal Supply 30 ns

Low propagation delay ensures fast response time, making the product efficient in data transmission.

Surface Mount YES

Surface mount capability allows for easy and secure installation on PCBs, saving space and facilitating mass production.

No. of Functions 2

Having multiple functions in one device increases versatility and functionality, reducing the need for additional components.

Screening Level AEC-Q100

AEC-Q100 screening level ensures high quality and reliability, making the product suitable for automotive applications.

Package Shape RECTANGULAR

Rectangular package shape provides ease of handling and integration into existing electronic systems.

No. of Bits 4

Having 4 bits allows for a higher range of data processing and communication capabilities.

Nominal Supply Voltage / Vsup (V) 5

Operating at a nominal supply voltage of 5V makes the product compatible with standard power sources.

Load Capacitance (CL) 50 pF

Low load capacitance minimizes signal distortion and loss, ensuring high signal integrity.

Power Supplies (V) 5

Operating at 5V power supplies allows for compatibility with common electronic systems and power sources.

No. of Terminals 20

Having 20 terminals enables connectivity to multiple input/output devices, enhancing versatility and usability.

Package Style (Meter) SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline and thin profile design with shrink pitch allows for compact and efficient PCB layout, saving space and cost.

Maximum I (ol) 6 Amp

High maximum output current capability of 6A ensures compatibility with a wide range of load requirements.

Propagation Delay (tpd) 30 ns

Low propagation delay of 30ns ensures fast data transmission, reducing latency and improving overall performance.

Maximum Operating Temperature 125 °C

High maximum operating temperature of 125 °C enables reliable operation in harsh environmental conditions.

Output Characteristics 3-STATE

3-STATE output characteristics allow for tri-state logic control, enabling flexible signal routing and multiple device connectivity.

Minimum Operating Temperature -55 °C

Low minimum operating temperature of -55 °C ensures reliable performance in extreme cold conditions.

Terminal Finish NICKEL PALLADIUM GOLD

Terminal finish with nickel, palladium, and gold provides corrosion resistance and reliable electrical connections.

Terminal Position DUAL

Dual terminal position enables flexible mounting options and ease of PCB layout for various system configurations.

No. of Ports 2

Having 2 ports allows for simultaneous data transmission to multiple devices, improving efficiency and system throughput.

Maximum Seated Height 1.2 mm

Low maximum seated height of 1.2mm enables compact and space-efficient PCB design, reducing overall system size.

Width 4.4 mm

Narrow width of 4.4mm allows for dense PCB layout and space-saving integration in electronic systems.

Output Polarity TRUE

True output polarity ensures accurate signal representation and compatibility with standard logic levels.

Minimum Supply Voltage (Vsup) 4.5 V

Low minimum supply voltage of 4.5V allows for operation in low-power applications and energy-efficient designs.

Maximum Time At Peak Reflow Temperature (s) 30

Maximum time at peak reflow temperature of 30 seconds ensures safe and reliable soldering during PCB assembly.

Peak Reflow Temperature °C 260

High peak reflow temperature of 260 °C ensures proper soldering and robust mechanical connections during PCB assembly.

Length 6.6 mm

Compact length of 6.6mm allows for space-efficient PCB layout and integration in tight spaces.

Temperature Grade MILITARY

Military-grade temperature rating ensures reliable operation in extreme environmental conditions and critical applications.

Technology CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of electronic systems.

Terminal Form GULL WING

Gull wing terminal form provides secure mechanical support and easy soldering during PCB assembly.

Packing Method TR

TR packing method ensures safe and convenient handling, storage, and transportation of the product.

Terminal Pitch 0.65 mm

Narrow terminal pitch of 0.65mm allows for high-density PCB layout and efficient signal routing.

Control Type ENABLE LOW

Enable low control type offers flexible signal control and integration with a wide range of electronic systems.

Maximum Supply Voltage (Vsup) 5.5 V

High maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources and system requirements.

Technical Specifications

Bus Driver & Transceivers NLVHCT244ADTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLVHCT244ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 9