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NLVHCT374ADTR2G

Onsemi

NLVHCT374ADTR2G by Onsemi

NLVHCT374ADTR2G by Onsemi is an 8-bit bus driver with a supply voltage of 5V, featuring a propagation delay of 47ns. Ideal for military applications, this CMOS technology device operates b/w -55 to 125 °C and offers a compact package style for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,206 parts In-Stock

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Digiode

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Microchip USA

USA . 3,588 parts In-Stock

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AZTECH Wire

Italy . 464 parts In-Stock

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SupplyDigital Components

Austria . 6,430 parts In-Stock

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Kulean Microsystems

USA . 4,072 parts In-Stock

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Problanco Electronics

Mexico . 3,424 parts In-Stock

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TANS Electronics

Latvia . 1,679 parts In-Stock

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Corphita

USA . 1,005 parts In-Stock

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Vigor

Singapore . 634 parts In-Stock

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UHIMA Technologies

Türkiye . 555 parts In-Stock

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Corohmni

South Africa . 315 parts In-Stock

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Overview

Enhance your electronic designs with the NLVHCT374ADTR2G by Onsemi, a premium quality bus driver and transceiver. Manufactured by Onsemi, this product offers exceptional performance and reliability for various applications. With a compact package design and 8-bit capacity, this component provides efficient signal transmission at a nominal supply voltage of 5V. Experience seamless operation and enhanced connectivity with the NLVHCT374ADTR2G, delivering value and benefits to customers looking for top-notch electronic components. Upgrade your projects today with this impressive device!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, ideal for transportation applications.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage which is commonly used in electronic systems, ensuring compatibility with a wide range of devices.

Propagation Delay (tpd): 47 ns

The low propagation delay of 47 ns ensures fast signal transmission, making the product suitable for high-speed data communication.

Maximum Operating Temperature: 125 °C

Capable of operating at a high temperature of 125 °C, making it suitable for industrial environments where temperature fluctuations may occur.

Output Characteristics: 3-STATE

The 3-STATE output allows for flexibility in controlling the output signal, enabling the product to interface with multiple devices.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers NLVHCT374ADTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

47 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLVHCT374ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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