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NLVHCT541ADWR2G

Onsemi

NLVHCT541ADWR2G by Onsemi

NLVHCT541ADWR2G by Onsemi is an 8-bit bus driver with a supply voltage of 5V, operating temperature range of -55 to 125 °C, and propagation delay of 32ns. It is used in applications requiring true output polarity, such as military-grade systems, with a small outline package style for compact designs.

Median Price

$0.424

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,000 parts In-Stock

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$0.424

10k+ parts

$0.388

1,000

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$0.424

$0.388

Distributors (In-Stock)

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Flip Electronics

USA . 28,000 parts In-Stock

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Vyrian

USA . 7,476 parts In-Stock

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7,476

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Digiode

USA . 922 parts In-Stock

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922

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Distributors (Availability)

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Ampacity Inc.

Singapore . 931 parts In-Stock

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$0.388

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931

$0.388

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Corohmni

South Africa . 334 parts In-Stock

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$1.610

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334

$1.610

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Microchip USA

USA . 1,938 parts In-Stock

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$2.956

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$2.956

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TANS Electronics

Latvia . 8,120 parts In-Stock

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SupplyDigital Components

Austria . 7,733 parts In-Stock

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7,733

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Kulean Microsystems

USA . 3,894 parts In-Stock

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Corphita

USA . 2,165 parts In-Stock

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Problanco Electronics

Mexico . 1,185 parts In-Stock

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Vigor

Singapore . 716 parts In-Stock

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UHIMA Technologies

Türkiye . 620 parts In-Stock

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Overview

Elevate your electronic designs with the NLVHCT541ADWR2G by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch Bus Driver & Transceivers that guarantee quality and reliability. This product is perfect for a wide range of applications, offering customers seamless performance and efficiency. Say goodbye to technical headaches and hello to smooth operations with the NLVHCT541ADWR2G. Upgrade your projects today and experience the benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver and transceivers, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation of the product onto circuit boards, saving time and effort during the manufacturing process.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality, making this product suitable for automotive applications where robust performance is essential.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage provides a stable power source for the bus driver and transceivers, ensuring consistent and efficient operation.

Propagation Delay (tpd): 32 ns

With a low propagation delay, this product enables fast data transmission and processing, making it ideal for applications that require quick response times.

Technical Specifications

Bus Driver & Transceivers NLVHCT541ADWR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay (tpd):

32 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

NLVHCT541ADWR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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