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NLV74HC238ADTR2G

Onsemi

NLV74HC238ADTR2G by Onsemi

NLV74HC238ADTR2G by Onsemi is a 16-terminal decoder & driver with CMOS technology. It operates b/w -55 to 125 °C, suitable for military-grade applications. With a supply voltage range of 2-6V, it features true output polarity and AEC-Q100 screening level for automotive electronics.

Median Price

$3.099

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,473 parts In-Stock

1+ parts

$0.198

100+ parts

$0.186

1k+ parts

$0.168

10k+ parts

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6,473

$0.198

$0.186

$0.168

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DigiKey

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$6.000

1k+ parts

$6.000

10k+ parts

$6.000

2,500

-

$6.000

$6.000

$6.000

Flip Electronics (Authorized)

USA . 2,500 parts In-Stock

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2,500

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Distributors (In-Stock)

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Digiode

USA . 514 parts In-Stock

1+ parts

$0.188

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514

$0.188

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Vyrian

USA . 188 parts In-Stock

1+ parts

$0.198

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188

$0.198

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Flip Electronics

USA . 2,500 parts In-Stock

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2,500

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Bristol Electronics

USA . 461 parts In-Stock

1+ parts

-

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$1.012

1k+ parts

$0.945

10k+ parts

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461

-

$1.012

$0.945

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Distributors (Availability)

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Corphita

USA . 310 parts In-Stock

1+ parts

$0.178

100+ parts

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310

$0.178

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Vigor

Singapore . 194 parts In-Stock

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$0.180

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194

$0.180

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Corohmni

South Africa . 490 parts In-Stock

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$0.198

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490

$0.198

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$9.885

100+ parts

$8.995

1k+ parts

$8.106

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350

$9.885

$8.995

$8.106

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QUARKTWIN TECHNOLOGY LTD

USA . 24,258 parts In-Stock

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Kulean Microsystems

USA . 5,077 parts In-Stock

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Problanco Electronics

Mexico . 5,047 parts In-Stock

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Microchip USA

USA . 4,585 parts In-Stock

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Formix International (Excess)

India . 2,500 parts In-Stock

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TANS Electronics

Latvia . 2,008 parts In-Stock

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UHIMA Technologies

Türkiye . 612 parts In-Stock

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612

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SupplyDigital Components

Austria . 365 parts In-Stock

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365

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Overview

Unlock the power of efficient decoding and driving with the NLV74HC238ADTR2G by Onsemi. This high-quality decoder & driver offers reliability, versatility, and precision for a wide range of applications. Manufactured with top-notch materials and advanced technology, this product ensures optimal performance even in extreme conditions. With its compact design and superior features, the NLV74HC238ADTR2G provides unmatched value, benefits, and advantages to customers looking for a reliable solution to their decoding and driving needs. Choose Onsemi for quality you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto PCBs, saving space and simplifying assembly processes.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with common voltage levels, making it versatile for different electronic systems.

Screening Level: AEC-Q100

AEC-Q100 screening level indicates high reliability and quality standards, ideal for automotive applications or harsh environments.

Nominal Supply Voltage/Vsup (V): 5

A nominal supply voltage of 5V is common and widely compatible with many electronic systems, offering ease of integration.

No. of Terminals: 16

Having 16 terminals provides flexibility for connecting multiple input and output signals, suitable for complex circuit designs.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, the product can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: -55 °C

The ability to operate at -55 °C ensures reliability in extreme cold conditions, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, enhancing the product's reliability and longevity.

Maximum Seated Height: 1.2 mm

A low maximum seated height of 1.2mm allows for compact design integration and space-saving in electronic assemblies.

Output Polarity: TRUE

True output polarity ensures accurate signal processing and compatibility with logic circuits, enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and provides mechanical strength, ensuring secure connections on PCBs.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6V provides flexibility for operation in various voltage environments, making the product versatile and compatible.

Technical Specifications

Decoder & Drivers NLV74HC238ADTR2G attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74HC238ADTR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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