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NLV74LCX138DTG

Onsemi

NLV74LCX138DTG by Onsemi

NLV74LCX138DTG by Onsemi is a 16-terminal decoder with 7.2ns propagation delay, operating b/w -40 to 85 °C. It has inverted output polarity and CMOS technology, suitable for industrial applications requiring AEC-Q100 screening and a supply voltage range of 2-3.6V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

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< 1k

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Vyrian

USA . 597 parts In-Stock

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Digiode

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SupplyDigital Components

Austria . 7,285 parts In-Stock

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Kulean Microsystems

USA . 7,277 parts In-Stock

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TANS Electronics

Latvia . 6,223 parts In-Stock

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Problanco Electronics

Mexico . 3,682 parts In-Stock

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UHIMA Technologies

Türkiye . 431 parts In-Stock

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Corohmni

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Corphita

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Overview

Discover the innovative NLV74LCX138DTG by Onsemi, a top-tier manufacturer known for delivering high-quality decoder & drivers. This versatile product offers unmatched value and benefits, making it the perfect choice for a variety of applications. With a durable plastic/epoxy package, fast propagation delay, and wide temperature range, this small outline device ensures reliable performance in industrial settings. Trust Onsemi to provide cutting-edge technology that exceeds expectations and drives your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components, making this product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and simplifying assembly processes.

Propagation Delay (tpd): 7.2 ns

Fast propagation delay ensures rapid signal processing, making this decoder & driver ideal for high-speed applications.

Nominal Supply Voltage / Vsup (V): 2.5

Stable supply voltage of 2.5V ensures reliable operation and compatibility with a wide range of systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance allows this product to perform reliably in harsh industrial environments with varying temperatures.

Technology: CMOS

Use of CMOS technology results in low power consumption and higher noise immunity, making this decoder & driver efficient and reliable.

Technical Specifications

Decoder & Drivers NLV74LCX138DTG attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

7.2 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

NLV74LCX138DTG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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