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NLV74LCX138DR2G

Onsemi

NLV74LCX138DR2G by Onsemi

NLV74LCX138DR2G by Onsemi is a 16-terminal decoder with 6ns propagation delay at 2.5V, suitable for industrial applications. It operates b/w -40 to 85 °C, has inverted output polarity, and supports a max supply voltage of 3.6V. Ideal for compact designs requiring fast signal processing in harsh environments.

Median Price

$0.630

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,389 parts In-Stock

1+ parts

$0.630

100+ parts

$0.348

1k+ parts

$0.297

10k+ parts

$0.263

2,389

$0.630

$0.348

$0.297

$0.263

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,970 parts In-Stock

1+ parts

$1.140

100+ parts

-

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1,970

$1.140

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Vyrian

USA . 1,697 parts In-Stock

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$1.200

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1,697

$1.200

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Flip Electronics

USA . 15,000 parts In-Stock

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15,000

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Distributors (Availability)

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Vigor

Singapore . 197 parts In-Stock

1+ parts

$0.290

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197

$0.290

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Corphita

USA . 647 parts In-Stock

1+ parts

$1.080

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647

$1.080

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Corohmni

South Africa . 477 parts In-Stock

1+ parts

$1.200

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477

$1.200

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Microchip USA

USA . 5,219 parts In-Stock

1+ parts

$1.978

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5,219

$1.978

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TANS Electronics

Latvia . 6,428 parts In-Stock

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6,428

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Kulean Microsystems

USA . 5,882 parts In-Stock

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5,882

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Problanco Electronics

Mexico . 5,208 parts In-Stock

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5,208

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UHIMA Technologies

Türkiye . 581 parts In-Stock

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581

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SupplyDigital Components

Austria . 143 parts In-Stock

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143

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Overview

Experience the unmatched quality and reliability of Onsemi with the NLV74LCX138DR2G decoder & driver. This versatile component offers fast propagation delays, low power consumption, and a wide temperature range, making it ideal for industrial applications where precision is key. With its compact design and advanced technology, this product provides customers with unmatched value and performance. Trust Onsemi to deliver innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Ensures durability and protection for the internal components of the decoder & drivers.

Propagation Delay At Nominal Supply: 6 ns

Provides fast response time for signal processing, ideal for time-sensitive applications.

Surface Mount: YES

Enables easy and convenient installation on circuit boards, saving assembly time.

Nominal Supply Voltage / Vsup (V): 2.5

Works efficiently at a standard voltage, ensuring compatibility with a wide range of systems.

Maximum I (ol): 24 Amp

Capable of handling high output currents, making it suitable for driving various loads.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures, suitable for applications in cold environments.

Terminal Finish: MATTE TIN

Provides a reliable and consistent electrical connection for long-term performance.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high noise immunity.

Technical Specifications

Decoder & Drivers NLV74LCX138DR2G attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

7.2 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV74LCX138DR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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