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NLV74LCX138DTR2G

Onsemi

NLV74LCX138DTR2G by Onsemi

NLV74LCX138DTR2G by Onsemi is a CMOS Decoder & Driver with 16 terminals, 7.2ns propagation delay, and operates b/w -40 to 85 °C. It has inverted output polarity and AEC-Q100 screening level, suitable for industrial applications requiring fast signal decoding in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,896 parts In-Stock

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Digiode

USA . 1,524 parts In-Stock

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Problanco Electronics

Mexico . 7,794 parts In-Stock

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SupplyDigital Components

Austria . 7,470 parts In-Stock

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TANS Electronics

Latvia . 7,247 parts In-Stock

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Kulean Microsystems

USA . 2,097 parts In-Stock

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UHIMA Technologies

Türkiye . 780 parts In-Stock

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780

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Corphita

USA . 275 parts In-Stock

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Corohmni

South Africa . 75 parts In-Stock

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Overview

Unlock the power of your electronics with the NLV74LCX138DTR2G by Onsemi. Built with precision and expertise, Onsemi is a trusted name in the industry known for delivering high-quality products. The NLV74LCX138DTR2G falls under the Decoder & Drivers category, offering exceptional performance and reliability. Ideal for a wide range of applications, this product provides unrivaled value and benefits to customers. Upgrade your projects with the NLV74LCX138DTR2G and experience the difference that Onsemi's superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the decoder & driver.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making this product versatile and easy to integrate into various systems.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V provides stable power to the decoder & driver, ensuring consistent performance.

Propagation Delay (tpd): 7.2 ns

The low propagation delay of 7.2ns ensures quick and efficient signal processing, making this product suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this decoder & driver can withstand harsh environmental conditions, ensuring reliable operation.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Decoder & Drivers NLV74LCX138DTR2G attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

7.2 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

NLV74LCX138DTR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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