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NLAS4684FCTCG

Onsemi

NLAS4684FCTCG by Onsemi

NLAS4684FCTCG by Onsemi is a CMOS SPDT switch with 2 functions, 10 terminals, and 1 ohm max resistance. Operating b/w -55 to 125 °C, it has separate outputs and 0.5 mm terminal pitch. Ideal for military-grade applications requiring fast switching times and high isolation levels.

Median Price

$0.168

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 3,000 parts In-Stock

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$0.168

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Vyrian

USA . 2,281 parts In-Stock

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Digiode

USA . 185 parts In-Stock

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Vigor

Singapore . 162 parts In-Stock

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$1.040

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162

$1.040

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$4.227

100+ parts

$3.847

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$3.466

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100

$4.227

$3.847

$3.466

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AZTECH Wire

Italy . 328 parts In-Stock

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$21.740

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Problanco Electronics

Mexico . 5,428 parts In-Stock

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Perfect Parts

USA . 4,480 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 2,927 parts In-Stock

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Corphita

USA . 1,403 parts In-Stock

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SupplyDigital Components

Austria . 1,010 parts In-Stock

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Corohmni

South Africa . 409 parts In-Stock

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Microchip USA

USA . 391 parts In-Stock

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UHIMA Technologies

Türkiye . 161 parts In-Stock

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TANS Electronics

Latvia . 108 parts In-Stock

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Overview

Enhance your electronic devices with the NLAS4684FCTCG by Onsemi, a top-tier manufacturer known for quality and reliability. This multiplexer & switch offers seamless functionality with its 2 functions, delivering superior performance in a compact package. Perfect for a wide range of applications, this product ensures precise control and efficiency, making it a valuable asset to any project. Upgrade your systems today with the NLAS4684FCTCG and experience the difference in quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer or switch, ensuring a longer lifespan.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Offers versatility and flexibility in the switching options, allowing for multiple signal paths to be controlled.

Nominal Supply Voltage (Vsup): 3 V

Compatible with various electronic systems that operate at common voltage levels, ensuring seamless integration.

Maximum Operating Temperature: 125 °C

Suitable for operation in a wide range of environmental conditions, making it ideal for diverse applications.

Minimum Operating Temperature: -55 °C

Can withstand extreme cold temperatures without compromising performance, ensuring reliability in harsh environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, resulting in efficient operation and minimal signal interference.

Technical Specifications

Multiplexers & Switches NLAS4684FCTCG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B10

JESD-609 Code:

e1

Length:

1.965 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

10

Nominal Off-state Isolation:

65 dB

Nominal On-state Resistance Match:

.06 ohm

Maximum On-state Resistance (Ron):

1 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA10,3X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.65 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

50 ns

Maximum Switch-on Time:

60 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

1.465 mm

Trade Compliance

NLAS4684FCTCG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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