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NLAS4053DTR2G

Onsemi

NLAS4053DTR2G by Onsemi

NLAS4053DTR2G by Onsemi is a CMOS multiplexer with 3 functions, 16 terminals, and -55 to 125°C operating range. Ideal for military-grade applications due to its small size, low power consumption (0.08mA), and high off-state isolation (93dB).

Median Price

$0.366

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 119 parts In-Stock

1+ parts

$0.377

100+ parts

$0.354

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$0.321

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119

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$0.321

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RS (Exports)

UK . 9,100 parts In-Stock

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$0.355

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$0.355

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Digiode

USA . 1,379 parts In-Stock

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$0.358

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$0.358

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Vyrian

USA . 8,665 parts In-Stock

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Rebound Electronics

UK . 912 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Corohmni

South Africa . 146 parts In-Stock

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$0.271

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$0.271

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Corphita

USA . 1,550 parts In-Stock

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$0.339

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$0.339

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Ampacity Inc.

Singapore . 5,157 parts In-Stock

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$0.500

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5,157

$0.500

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Continental Prestige Electronics

USA . 2,250 parts In-Stock

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$0.501

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$0.318

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$0.501

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Vigor

Singapore . 133 parts In-Stock

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$0.880

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$0.880

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Aztec Data Supply Inc.

USA . 1,740 parts In-Stock

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$2.980

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AZTECH Wire

Italy . 137 parts In-Stock

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$18.410

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Lixinc

USA . 18,551 parts In-Stock

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Microchip USA

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Problanco Electronics

Mexico . 5,332 parts In-Stock

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Kulean Microsystems

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Perfect Parts

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Kepictronics

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SupplyDigital Components

Austria . 1,625 parts In-Stock

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TANS Electronics

Latvia . 715 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 390 parts In-Stock

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UHIMA Technologies

Türkiye . 338 parts In-Stock

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Bastille Electronics

Australia . 87 parts In-Stock

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Overview

Enhance your electronic designs with the NLAS4053DTR2G by Onsemi, a high-quality multiplexer and switch that offers unparalleled performance. Manufactured by Onsemi, a renowned industry leader, this versatile component is ideal for a wide range of applications. With its advanced technology and reliable construction, this product provides exceptional value, benefits, and advantages to customers seeking superior functionality and efficiency in their projects. Elevate your work with the NLAS4053DTR2G and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

The surface mount capability allows for easy installation on PCBs, saving space and improving efficiency.

No. of Functions: 3

With 3 functions in one device, this multiplexer offers versatility and flexibility in circuit design.

Package Shape: RECTANGULAR

The rectangular shape of the package simplifies PCB layout and reduces the overall footprint of the device.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3V, this multiplexer is compatible with a wide range of electronics.

Power Supplies (V): -3.3/5

Capable of handling dual power supplies of -3.3V and 5V, this multiplexer is versatile in different applications.

No. of Terminals: 16

With 16 terminals, this multiplexer can accommodate multiple connections for complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style offers space-saving benefits and improved thermal characteristics.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this multiplexer can withstand harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Operating at a minimum temperature of -55°C, this multiplexer is suitable for a wide range of applications.

Technical Specifications

Multiplexers & Switches NLAS4053DTR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

Maximum Negative Supply Voltage (Vsup):

-5.5 V

Minimum Negative Supply Voltage (Vsup):

0 V

Nominal Negative Supply Voltage (Vsup):

-3 V

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Nominal Off-state Isolation:

93 dB

Nominal On-state Resistance Match:

15 ohm

Maximum On-state Resistance (Ron):

37 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3,3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Signal Current:

.05 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

28 ns

Maximum Switch-on Time:

28 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

NLAS4053DTR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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