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NID9N05CLT4

Onsemi

NID9N05CLT4 by Onsemi

NID9N05CLT4 by Onsemi is a single N-channel FET with built-in diode for switching applications. It features a min DS breakdown voltage of 52V, max pulsed drain current of 35A, and max power dissipation of 28.8W. This MOSFET operates in enhancement mode with a max operating temperature of 175 °C, making it suitable for high-power switching applications.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Chip Stock

USA . 5,600 parts In-Stock

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Vyrian

USA . 3,970 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 38 parts In-Stock

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$8.920

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38

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Metaverse IC Inc.

Canada . 38,652 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,072 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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TANS Electronics

Latvia . 7,983 parts In-Stock

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SupplyDigital Components

Austria . 6,487 parts In-Stock

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Problanco Electronics

Mexico . 4,338 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 1,633 parts In-Stock

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Vigor

Singapore . 982 parts In-Stock

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Corohmni

South Africa . 460 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 144 parts In-Stock

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Microchip USA

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Overview

Experience unmatched quality and reliability with the NID9N05CLT4 power FET by Onsemi. As a leader in semiconductor technology, Onsemi delivers top-notch products that exceed industry standards. Ideal for switching applications, this N-channel transistor offers superior performance and efficiency. With a built-in diode and a maximum pulsed drain current of 35A, this FET provides exceptional value and benefits to customers looking for high-quality components. Trust Onsemi to deliver cutting-edge solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and thermal conduction, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs have lower on-state resistance and higher mobility, resulting in better performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for safer and more efficient switching operations.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in this function.

Surface Mount: YES

Surface mount technology makes it easier to integrate this FET into various electronic devices.

Minimum DS Breakdown Voltage: 52 V

This high breakdown voltage ensures reliability and protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient packing and placement on circuit boards.

Terminal Form: GULL WING

Gull wing terminals provide better mechanical strength and solder joint reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and offer faster switching speeds.

Maximum Pulsed Drain Current (IDM): 35 A

High pulsed drain current allows for handling of sudden surges in power.

Avalanche Energy Rating (EAS): 160 mJ

The high avalanche energy rating ensures protection against voltage spikes and surges.

Maximum Drain Current (Abs) (ID): 9 A

A high maximum drain current allows for efficient power handling.

No. of Terminals: 2

Simpler design with fewer terminals makes it easier to integrate into circuits.

Maximum Power Dissipation (Abs): 28.8 W

High power dissipation rating allows for continuous operation under heavy loads.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability.

Maximum Operating Temperature: 175 °C

High operating temperature range allows for operation in various environments.

Transistor Element Material: SILICON

Silicon is a commonly used material for transistors due to its excellent electrical properties.

Terminal Finish: TIN LEAD

Tin lead finish provides better solderability and conductivity.

Maximum Drain-Source On Resistance: 0.181 ohm

Low on-resistance allows for efficient power handling with minimal losses.

Terminal Position: SINGLE

Single terminal position simplifies circuit integration and connection.

Case Connection: DRAIN

Drain connection offers better heat dissipation and electrical performance.

Peak Reflow Temperature °C: 235

High peak reflow temperature allows for reliable soldering during assembly processes.

Technical Specifications

Power Field Effect Transistors (FET) NID9N05CLT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ESD PROTECTED

Avalanche Energy Rating (EAS):

160 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

52 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.181 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

35 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NID9N05CLT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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