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NDT014

Onsemi

NDT014 by Onsemi

Onsemi's NDT014 is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 10A IDM and 0.2 ohm RDS(on), operating in ENHANCEMENT MODE at up to 150°C. With GULL WING terminals and built-in diode, it offers high performance in a SMALL OUTLINE package.

Median Price

$0.512

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,999 parts In-Stock

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$0.199

100+ parts

$0.190

1k+ parts

$0.181

10k+ parts

$0.178

3,999

$0.199

$0.190

$0.181

$0.178

Mouser Electronics

USA . 37,240 parts In-Stock

1+ parts

$1.550

100+ parts

$0.656

1k+ parts

$0.449

10k+ parts

$0.424

37,240

$1.550

$0.656

$0.449

$0.424

DigiKey

USA . 15,528 parts In-Stock

1+ parts

$1.550

100+ parts

$0.655

1k+ parts

$0.469

10k+ parts

$0.372

15,528

$1.550

$0.655

$0.469

$0.372

Rochester

USA . 26,262 parts In-Stock

1+ parts

-

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$0.503

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$0.418

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$0.372

26,262

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$0.503

$0.418

$0.372

Verical

USA . 20,666 parts In-Stock

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$0.522

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$0.466

20,666

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$0.522

$0.466

Chip1Stop

Japan . 3,441 parts In-Stock

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$0.446

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$0.347

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3,441

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$0.446

$0.347

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Distributors (In-Stock)

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Digiode

USA . 2,687 parts In-Stock

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$0.391

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Vyrian

USA . 40,864 parts In-Stock

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Bristol Electronics

USA . 9,744 parts In-Stock

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Inventory MP

USA . 8,984 parts In-Stock

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Chip Stock

USA . 8,500 parts In-Stock

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Martec Srl

Italy . 3,929 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,522 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3,435 parts In-Stock

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Anansix

USA . 1,871 parts In-Stock

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A&K Electronics

USA . 760 parts In-Stock

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760

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Rotakorn

Sweden . 760 parts In-Stock

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Electronic Expediters

USA . 30 parts In-Stock

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30

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 41,009 parts In-Stock

1+ parts

$0.310

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41,009

$0.310

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Corohmni

South Africa . 400 parts In-Stock

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$0.365

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400

$0.365

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Corphita

USA . 984 parts In-Stock

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$0.371

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984

$0.371

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Aztec Data Supply Inc.

USA . 265 parts In-Stock

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$1.181

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265

$1.181

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Perfect Parts

USA . 406,550 parts In-Stock

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Kepictronics

USA . 27,860 parts In-Stock

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GreenTree Electronics

Israel . 24,000 parts In-Stock

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Kulean Microsystems

USA . 8,254 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Problanco Electronics

Mexico . 6,574 parts In-Stock

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SupplyDigital Components

Austria . 6,453 parts In-Stock

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Lixinc

USA . 5,804 parts In-Stock

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Argo Parts USA

USA . 4,026 parts In-Stock

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Eastek

USA . 4,000 parts In-Stock

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TANS Electronics

Latvia . 3,665 parts In-Stock

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iodParts Technologies Inc.

India . 3,435 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 3,435 parts In-Stock

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Supply Digital

USA . 2,895 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,441 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Continental Prestige Electronics

USA . 364 parts In-Stock

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UHIMA Technologies

Türkiye . 314 parts In-Stock

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Overview

Experience superior power management with the NDT014 by Onsemi. Crafted with precision and expertise, this high-quality Power Field Effect Transistor (FET) is designed for efficiency and reliability. Perfect for switching applications, this N-CHANNEL transistor offers a built-in diode, enhancing its performance. With a 60V minimum DS breakdown voltage and a maximum pulsing drain current of 10A, this FET ensures seamless operations. Trust Onsemi for top-of-the-line technology that delivers unmatched power control and optimized performance. Elevate your projects with the NDT014 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packaging offers good protection and durability for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and better efficiency compared to P-channel FETs, making them a preferred choice for many switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling of inductive loads in switching applications, providing added convenience and protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures reliable and efficient performance in tasks that require frequent ON/OFF switching.

Surface Mount: YES

Surface mount capability offers easy and compact integration onto PCBs, saving space and facilitating a streamlined manufacturing process.

Minimum DS Breakdown Voltage: 60 V

The 60V breakdown voltage allows for safe operation in systems with higher voltage requirements, enhancing the versatility of this FET.

Maximum Drain Current (Abs): 2.7 A

With a maximum drain current of 2.7A, this FET can handle moderate current loads effectively, making it suitable for various applications.

Maximum Power Dissipation (Abs): 3 W

The maximum power dissipation of 3W indicates good thermal performance, ensuring the FET can operate reliably under demanding conditions.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this FET can withstand elevated temperatures, making it suitable for industrial applications.

Maximum Drain-Source On Resistance: 0.2 ohm

The low drain-source on resistance of 0.2 ohm minimizes power loss and improves efficiency in switching applications, resulting in better overall performance.

Technical Specifications

Power Field Effect Transistors (FET) NDT014 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

2.7 A

Maximum Drain Current (ID):

2.7 A

Maximum Drain-Source On Resistance:

.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

3 W

Maximum Pulsed Drain Current (IDM):

10 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDT014 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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