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NDF10N60ZG

Onsemi

NDF10N60ZG by Onsemi

NDF10N60ZG by Onsemi is a Power FET with 600V DS Breakdown Voltage, 40A IDM, and 0.75 ohm RDS(on). Ideal for power applications requiring high voltage tolerance and low on-resistance. Suitable for use in enhancement mode operation at up to 150°C temperature.

Median Price

$0.726

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 97,497 parts In-Stock

1+ parts

-

100+ parts

$0.713

1k+ parts

$0.592

10k+ parts

$0.528

97,497

-

$0.713

$0.592

$0.528

Verical

USA . 77,483 parts In-Stock

1+ parts

-

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$0.740

10k+ parts

$0.660

77,483

-

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$0.740

$0.660

Distributors (In-Stock)

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Digiode

USA . 1,073 parts In-Stock

1+ parts

$0.556

100+ parts

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1,073

$0.556

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.607

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10

$0.607

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Chip Stock

USA . 9,001 parts In-Stock

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9,001

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Vyrian

USA . 3,017 parts In-Stock

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3,017

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ACDS - Activité Composants Distribution Service

France . 30 parts In-Stock

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30

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Holdelec - ElecDif-Pro

France . 30 parts In-Stock

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30

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Distributors (Availability)

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Ampacity Inc.

Singapore . 92,758 parts In-Stock

1+ parts

$0.497

100+ parts

-

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92,758

$0.497

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Corphita

USA . 775 parts In-Stock

1+ parts

$0.526

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775

$0.526

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Corohmni

South Africa . 154 parts In-Stock

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$0.585

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154

$0.585

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Argo Parts USA

USA . 2,163 parts In-Stock

1+ parts

$0.607

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$0.588

2,163

$0.607

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$0.588

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.607

100+ parts

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1k+ parts

$0.576

10k+ parts

$0.564

50

$0.607

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$0.576

$0.564

Microchip USA

USA . 496 parts In-Stock

1+ parts

$3.640

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496

$3.640

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AZTECH Wire

Italy . 385 parts In-Stock

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$12.590

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385

$12.590

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Continental Prestige Electronics

USA . 101,265 parts In-Stock

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$0.537

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$0.537

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RC Electronics

USA . 72,288 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,189 parts In-Stock

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TANS Electronics

Latvia . 3,745 parts In-Stock

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Problanco Electronics

Mexico . 2,811 parts In-Stock

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Kulean Microsystems

USA . 1,931 parts In-Stock

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Perfect Parts

USA . 822 parts In-Stock

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UHIMA Technologies

Türkiye . 736 parts In-Stock

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736

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SupplyDigital Components

Austria . 366 parts In-Stock

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Kepictronics

USA . 90 parts In-Stock

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Overview

Looking for a reliable and high-quality Power Field Effect Transistor (FET)? Look no further than the NDF10N60ZG by Onsemi. With a reputation for excellence in semiconductor technology, Onsemi delivers exceptional performance and durability with this N-CHANNEL FET. Ideal for a wide range of applications, this single configuration transistor offers customers value and benefits like enhanced power efficiency, increased reliability, and superior temperature management. Trust Onsemi to provide you with the best in semiconductor technology with the NDF10N60ZG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher mobility and conductivity, making them efficient for power applications.

Minimum DS Breakdown Voltage: 600 V

Can handle high voltage applications, ensuring reliable performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against voltage spikes.

Maximum Drain Current (ID): 10 A

Capable of handling high current loads, suitable for power applications.

Maximum Power Dissipation (Abs): 39 W

Can dissipate heat effectively, preventing overheating and ensuring long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and performance for power applications.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without compromising performance.

Maximum Drain-Source On Resistance: 0.75 ohm

Low on-resistance results in minimal power loss and better efficiency.

Case Connection: ISOLATED

Reduces the risk of short circuits and enhances safety in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) NDF10N60ZG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

40 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

NDF10N60ZG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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