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NDF10N62ZG

Onsemi

NDF10N62ZG by Onsemi

NDF10N62ZG by Onsemi is a Power FET with 620V DS Breakdown Voltage, 36A IDM, and 0.75 ohm RDS(on). It is an N-CHANNEL transistor for SWITCHING applications. Operating in ENHANCEMENT MODE, it has a max temp of 150 °C and EAS of 300mJ.

Median Price

$31.870

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 15 parts In-Stock

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$31.870

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Digiode

USA . 1,125 parts In-Stock

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$30.276

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Vyrian

USA . 5,107 parts In-Stock

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J2 Sourcing AB

Sweden . 2,000 parts In-Stock

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AZTECH Wire

Italy . 172 parts In-Stock

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$18.760

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Ampacity Inc.

Singapore . 15 parts In-Stock

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$27.090

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Corphita

USA . 303 parts In-Stock

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$28.683

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Corohmni

South Africa . 405 parts In-Stock

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Problanco Electronics

Mexico . 8,275 parts In-Stock

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Kulean Microsystems

USA . 4,955 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,799 parts In-Stock

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TANS Electronics

Latvia . 3,210 parts In-Stock

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SupplyDigital Components

Austria . 1,236 parts In-Stock

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Perfect Parts

USA . 823 parts In-Stock

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UHIMA Technologies

Türkiye . 514 parts In-Stock

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Kepictronics

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Overview

Experience the superior quality and reliability of the NDF10N62ZG Power FET by Onsemi. With a focus on innovation and cutting-edge technology, Onsemi is a trusted manufacturer known for delivering high-performance components. Ideal for switching applications, this N-Channel transistor offers a seamless operation with its built-in diode configuration. Enhance your projects with the maximum pulsed drain current of 36 A and a minimum DS breakdown voltage of 620 V, providing unmatched efficiency and power distribution. Take your designs to the next level with the NDF10N62ZG and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher mobility and conductivity compared to P-channel FETs, making them more efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling operation, helping to protect the circuitry from voltage spikes and reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast and reliable switching capabilities for various electronic circuits.

Minimum DS Breakdown Voltage: 620 V

With a minimum breakdown voltage of 620V, this FET can handle high voltage applications with ease, ensuring reliable performance under different operating conditions.

Maximum Pulsed Drain Current (IDM): 36 A

The high pulsed drain current rating of 36A allows for robust performance during peak load conditions, making it suitable for heavy-duty applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high temperature environments, ensuring stable operation even under extreme conditions.

Technical Specifications

Power Field Effect Transistors (FET) NDF10N62ZG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

620 V

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

36 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDF10N62ZG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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