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NCV8403STT3G

Onsemi

NCV8403STT3G by Onsemi

NCV8403STT3G by Onsemi is an AEC-Q100 compliant peripheral driver with built-in protections for transient, over current, and over voltage. It operates in automotive applications at temperatures ranging from -40 to 150 °C. This small outline package IC has a nominal voltage of 5V and a sink output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 34,000 parts In-Stock

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Vyrian

USA . 8,051 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 363 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

USA . 27,860 parts In-Stock

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SupplyDigital Components

Austria . 5,947 parts In-Stock

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Problanco Electronics

Mexico . 5,500 parts In-Stock

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TANS Electronics

Latvia . 4,543 parts In-Stock

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Corphita

USA . 2,481 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,616 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 502 parts In-Stock

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Microchip USA

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Overview

Unlock the full potential of your automotive applications with the NCV8403STT3G by Onsemi. Built with robust built-in protections against transient, over current, and over voltage, this peripheral driver ensures reliable performance in any driving scenario. With a compact design and high-temperature grade, this product offers unparalleled value and benefits to customers looking for a durable and efficient solution. Trust in Onsemi's reputation for quality and innovation, and elevate your automotive electronics to the next level with the NCV8403STT3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the peripheral driver lightweight and durable, ensuring long-term reliability.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The presence of multiple built-in protections ensures the safety of the connected peripherals, protecting them from common electrical issues such as overvoltage, overcurrent, and thermal issues.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this peripheral driver can withstand harsh environmental conditions, making it suitable for automotive applications where temperatures can vary.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 volts makes this peripheral driver compatible with a wide range of devices and systems that operate on standard voltage levels, providing versatility in applications.

Technical Specifications

Peripheral Drivers NCV8403STT3G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Width:

3.5 mm

Trade Compliance

NCV8403STT3G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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