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NCV8402STT3G

Onsemi

NCV8402STT3G by Onsemi

NCV8402STT3G by Onsemi is a small outline peripheral driver with built-in protections against transient, over current, and over voltage. It has a nominal output peak current limit of 4.8A and a turn-on time of 25us. Ideal for applications requiring sink output current flow direction in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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J2 Sourcing AB

Sweden . 75,838 parts In-Stock

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75,838

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Chip Stock

USA . 9,500 parts In-Stock

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9,500

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Infinite Electronics LLP

India . 7,641 parts In-Stock

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Vyrian

USA . 7,577 parts In-Stock

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7,577

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Digiode

USA . 2,380 parts In-Stock

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2,380

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Nova Conductors

Japan . 17 parts In-Stock

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Ampacity Inc.

Singapore . 487 parts In-Stock

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$1.500

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487

$1.500

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Aztec Data Supply Inc.

USA . 3,833 parts In-Stock

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$7.510

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3,833

$7.510

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AZTECH Wire

Italy . 802 parts In-Stock

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$13.222

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802

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RC Electronics

USA . 58,500 parts In-Stock

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58,500

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Kepictronics

USA . 27,860 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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TANS Electronics

Latvia . 3,312 parts In-Stock

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Continental Prestige Electronics

USA . 2,992 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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Kulean Microsystems

USA . 1,464 parts In-Stock

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Argo Parts USA

USA . 1,277 parts In-Stock

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Lixinc

USA . 1,188 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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SupplyDigital Components

Austria . 909 parts In-Stock

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Problanco Electronics

Mexico . 824 parts In-Stock

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Corphita

USA . 635 parts In-Stock

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Microchip USA

USA . 439 parts In-Stock

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Corohmni

South Africa . 67 parts In-Stock

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UHIMA Technologies

Türkiye . 43 parts In-Stock

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Overview

Discover the NCV8402STT3G by Onsemi, a top-quality peripheral driver with built-in protections against transient, over current, over voltage, and thermal issues. This small outline package offers a compact design perfect for various applications in the automotive industry, industrial automation, and more. With a nominal output peak current limit of 4.8A, this product provides reliable performance and efficient operation. Trust Onsemi's expertise and innovation to deliver exceptional value and benefits to meet your needs. Elevate your projects with the NCV8402STT3G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Ensures safety and protection for both the peripheral driver and connected devices, preventing damage from electrical faults.

No. of Terminals: 4

Provides sufficient connectivity options for interfacing with other components in a circuit.

Width: 3.5 mm

Compact size allows for space-efficient placement within electronic devices or systems.

Turn-on Time: 25 us

Quick response time ensures rapid activation of connected peripherals, enhancing overall system performance.

Nominal Output Peak Current Limit: 4.8 A

Capable of handling high current loads, making it suitable for driving power-hungry peripherals efficiently.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface IC type allows compatibility with a wide range of peripheral devices, offering flexibility in design and implementation.

Output Current Flow Direction: SINK

Supports sink current flow direction, ideal for driving components that require a ground connection for operation.

Technical Specifications

Peripheral Drivers NCV8402STT3G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

4.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Turn-off Time:

120 us

Turn-on Time:

25 us

Width:

3.5 mm

Trade Compliance

NCV8402STT3G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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