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NCV7341D21R2G

Onsemi

NCV7341D21R2G by Onsemi

NCV7341D21R2G by Onsemi is a 14-terminal network interface with 5V power supply, operating b/w -40 to 125 °C. It features a data rate of 1 Mbps and is ideal for automotive applications due to its AEC-Q100 screening level. The package style is small outline, making it suitable for surface mount assembly in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

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1k+

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Chip Stock

USA . 73,000 parts In-Stock

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USA . 15,000 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

UK . 5,938 parts In-Stock

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Digiode

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Sensible Micro Corp

USA . 610 parts In-Stock

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R&J Components

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Vigor

Singapore . 282 parts In-Stock

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$1.700

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Advanced Electronics

New Zealand . 900 parts In-Stock

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$8.438

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$7.679

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$6.919

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AZTECH Wire

Italy . 331 parts In-Stock

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$15.430

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Perfect Parts

USA . 3,751,557 parts In-Stock

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Problanco Electronics

Mexico . 7,461 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 6,720 parts In-Stock

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Kepictronics

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iodParts Technologies Inc.

India . 2,919 parts In-Stock

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GreenTree Electronics

Israel . 1,750 parts In-Stock

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TANS Electronics

Latvia . 1,550 parts In-Stock

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UHIMA Technologies

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Microchip USA

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Overview

Enhance the performance of your automotive network interfaces with the NCV7341D21R2G by Onsemi. Designed with high-quality materials and a compact package style, this interface circuit offers reliable connectivity for a wide range of applications. With a nominal supply voltage of 5V and a maximum data rate of 1Mbps, this product provides exceptional value and efficiency. Trust in Onsemi's reputation for excellence in the industry and experience the benefits of seamless communication in your automotive systems with the NCV7341D21R2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for automotive applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable makes this product easy to integrate into circuit boards, saving space and simplifying the assembly process.

Power Supplies (V): 5

Operating at a standard voltage of 5V, this product is compatible with most common power sources, ensuring easy integration into existing systems.

No. of Terminals: 14

With a sufficient number of terminals, this product offers versatility in connectivity options, allowing for various configurations to meet different application requirements.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for automotive applications where temperature fluctuations are common.

Technical Specifications

Network Interfaces NCV7341D21R2G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.6868 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.7272 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.08 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.937 mm

Trade Compliance

NCV7341D21R2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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