Loading...

NCV303150MTW

Onsemi

NCV303150MTW by Onsemi

NCV303150MTW by Onsemi is a Power Management IC with AEC-Q100 screening. It has a Nominal Voltage of 5V, Min Operating Temperature of -40 °C, and Max Seated Height of 0.85mm. Ideal for automotive applications requiring a compact and efficient power supply support circuit in a surface-mount package.

Median Price

$3.622

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,210 parts In-Stock

1+ parts

-

100+ parts

$3.220

1k+ parts

$2.880

10k+ parts

$2.710

10,210

-

$3.220

$2.880

$2.710

Verical

USA . 7,955 parts In-Stock

1+ parts

-

100+ parts

$4.025

1k+ parts

$3.600

10k+ parts

-

7,955

-

$4.025

$3.600

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,002 parts In-Stock

1+ parts

$3.410

100+ parts

-

1k+ parts

-

10k+ parts

-

1,002

$3.410

-

-

-

Vyrian

USA . 2,122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,122

-

-

-

-

ComSIT Distribution GmbH

Germany . 54 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

54

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,726 parts In-Stock

1+ parts

$3.231

100+ parts

-

1k+ parts

-

10k+ parts

-

1,726

$3.231

-

-

-

Corohmni

South Africa . 338 parts In-Stock

1+ parts

$3.590

100+ parts

-

1k+ parts

-

10k+ parts

-

338

$3.590

-

-

-

AZTECH Wire

Italy . 275 parts In-Stock

1+ parts

$10.760

100+ parts

-

1k+ parts

-

10k+ parts

-

275

$10.760

-

-

-

TANS Electronics

Latvia . 5,496 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,496

-

-

-

-

Kulean Microsystems

USA . 3,149 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,149

-

-

-

-

Problanco Electronics

Mexico . 2,410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,410

-

-

-

-

SupplyDigital Components

Austria . 2,052 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,052

-

-

-

-

Microchip USA

USA . 1,924 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,924

-

-

-

-

UHIMA Technologies

Türkiye . 851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

851

-

-

-

-

Overview

Experience superior power management with the NCV303150MTW by Onsemi. As a leader in the industry, Onsemi delivers high-quality Power Management ICs for automotive applications. This chip carrier features a very thin profile and a robust package body material for durability. With a wide operating temperature range and AEC-Q100 screening level, this product ensures reliable performance in extreme conditions. Trust Onsemi to provide innovative solutions that meet your power supply support circuit needs, offering unmatched value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the integrated circuit within.

Surface Mount: YES

Allows for easy installation onto printed circuit boards, making it convenient for assembly.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, suitable for automotive applications.

Nominal Supply Voltage (Vsup): 5 V

Provides a stable power input for the IC's operation.

No. of Terminals: 39

Offers multiple connection points for various input and output requirements.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

Can function in extremely low-temperature conditions, suitable for a wide range of applications.

Terminal Finish: Matte Tin (Sn) - annealed

Provides a corrosion-resistant finish for long-term reliability.

Width (mm): 5 mm

Compact size allows for integration into space-constrained designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply applications, ensuring efficient performance.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time for reflow soldering, facilitating easy manufacturing processes.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering without damage.

Nominal Threshold Voltage (V): +4.1V

Provides a precise threshold for input voltage detection, ensuring reliable operation.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for temperature range and reliability, suitable for automotive applications.

Terminal Form: NO LEAD

Lead-free terminals for environmental compliance and safety.

Terminal Pitch: 0.45 mm

Fine pitch terminals enable high-density mounting on PCBs.

Maximum Supply Voltage (Vsup): 5.5 V

Can safely handle higher supply voltages, providing flexibility in power input requirements.

Technical Specifications

Power Management ICs NCV303150MTW attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-PQCC-N39

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

39

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC39,.2X.24,18

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.85 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.45 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+4.1V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

NCV303150MTW Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20