Loading...

NCP81391AMNTXG

Onsemi

NCP81391AMNTXG by Onsemi

NCP81391AMNTXG by Onsemi is a MOSFET Gate Driver with 31 terminals, operating voltage range of 4.5V to 13.2V, and temperature grade suitable for automotive applications. It features high side driver capability, matte tin terminal finish, and compact chip carrier package style ideal for space-constrained designs in automotive electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,409

-

-

-

-

Vyrian

USA . 2,282 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,282

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 218 parts In-Stock

1+ parts

$10.560

100+ parts

-

1k+ parts

-

10k+ parts

-

218

$10.560

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 16,558 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,558

-

-

-

-

Problanco Electronics

Mexico . 7,772 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,772

-

-

-

-

SupplyDigital Components

Austria . 4,047 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,047

-

-

-

-

Kulean Microsystems

USA . 3,426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,426

-

-

-

-

TANS Electronics

Latvia . 2,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,560

-

-

-

-

Corphita

USA . 1,905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,905

-

-

-

-

Microchip USA

USA . 417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

417

-

-

-

-

Corohmni

South Africa . 253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

253

-

-

-

-

UHIMA Technologies

Türkiye . 101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

101

-

-

-

-

Overview

Discover the NCP81391AMNTXG by Onsemi, a top-of-the-line MOSFET Gate Driver that guarantees exceptional quality and reliability. With a wide range of applications in automotive technology, this chip carrier package delivers outstanding performance even in extreme temperatures. Its matte tin terminal finish ensures long-lasting durability, while its very thin profile allows for seamless integration in your designs. Trust Onsemi to provide cutting-edge solutions that add value to your projects. Experience the difference with the NCP81391AMNTXG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring reliability in various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 13.2 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, enhancing flexibility in design.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures compatibility with lower power sources, making it suitable for a variety of applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold environments without compromising performance.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and resistance to corrosion, ensuring a secure electrical connection.

Terminal Position: QUAD

The quad terminal position allows for easy connections and integration into circuit designs.

Width: 5 mm

The compact width of 5mm makes the package suitable for space-constrained applications while still providing high performance.

High Side Driver: YES

The presence of a high side driver allows for efficient control and management of power distribution, enhancing overall system performance.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliability in automotive applications where temperature variations are common.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V makes it compatible with standard power sources, simplifying integration into existing systems.

Technical Specifications

MOSFET Gate Drivers NCP81391AMNTXG attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

YES

JESD-30 Code:

S-PQCC-N31

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

31

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC31(UNSPEC)

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

13.2 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NCP81391AMNTXG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20