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NCP81080DR2G

Onsemi

NCP81080DR2G by Onsemi

NCP81080DR2G by Onsemi is a MOSFET gate driver with 8 terminals, operating temperature range of -40 to 140°C, and supply voltage from 5.5 to 20V. It is designed for automotive applications requiring high side drivers with small outline package style.

Median Price

$1.160

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 543 parts In-Stock

1+ parts

$1.620

100+ parts

$1.000

1k+ parts

$0.661

10k+ parts

$0.576

543

$1.620

$1.000

$0.661

$0.576

Chip1Stop

Japan . 150 parts In-Stock

1+ parts

$4.340

100+ parts

$1.820

1k+ parts

-

10k+ parts

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150

$4.340

$1.820

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Flip Electronics (Authorized)

USA . 2,563 parts In-Stock

1+ parts

-

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2,563

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DigiKey

USA . 1,793 parts In-Stock

1+ parts

-

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$1.160

1,793

-

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$1.160

Verical

USA . 511 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.809

10k+ parts

$0.721

511

-

-

$0.809

$0.721

Rochester

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$0.782

1k+ parts

$0.649

10k+ parts

$0.579

11

-

$0.782

$0.649

$0.579

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,933 parts In-Stock

1+ parts

$0.608

100+ parts

-

1k+ parts

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10k+ parts

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1,933

$0.608

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.733

100+ parts

-

1k+ parts

-

10k+ parts

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300

$0.733

-

-

-

TME

Poland . 455 parts In-Stock

1+ parts

$1.060

100+ parts

$0.790

1k+ parts

-

10k+ parts

-

455

$1.060

$0.790

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-

Chip Stock

USA . 42,000 parts In-Stock

1+ parts

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42,000

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Vyrian

USA . 4,908 parts In-Stock

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4,908

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Flip Electronics

USA . 1,793 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,793

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 828 parts In-Stock

1+ parts

$0.540

100+ parts

-

1k+ parts

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10k+ parts

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828

$0.540

-

-

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Corphita

USA . 1,228 parts In-Stock

1+ parts

$0.576

100+ parts

-

1k+ parts

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10k+ parts

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1,228

$0.576

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-

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Corohmni

South Africa . 280 parts In-Stock

1+ parts

$0.640

100+ parts

-

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280

$0.640

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-

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$0.718

100+ parts

-

1k+ parts

$0.690

10k+ parts

-

500

$0.718

-

$0.690

-

Continental Prestige Electronics

USA . 4,981 parts In-Stock

1+ parts

$0.733

100+ parts

-

1k+ parts

-

10k+ parts

$0.718

4,981

$0.733

-

-

$0.718

Argo Parts USA

USA . 198 parts In-Stock

1+ parts

$0.733

100+ parts

-

1k+ parts

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198

$0.733

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-

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Vigor

Singapore . 217 parts In-Stock

1+ parts

$1.220

100+ parts

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217

$1.220

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Microchip USA

USA . 3,884 parts In-Stock

1+ parts

$4.442

100+ parts

-

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3,884

$4.442

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Aztec Data Supply Inc.

USA . 147 parts In-Stock

1+ parts

$13.310

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147

$13.310

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Lixinc

USA . 9,405 parts In-Stock

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9,405

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SupplyDigital Components

Austria . 7,334 parts In-Stock

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7,334

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TANS Electronics

Latvia . 6,310 parts In-Stock

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6,310

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Problanco Electronics

Mexico . 3,428 parts In-Stock

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3,428

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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Kulean Microsystems

USA . 2,324 parts In-Stock

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2,324

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iodParts Technologies Inc.

India . 450 parts In-Stock

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450

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UHIMA Technologies

Türkiye . 200 parts In-Stock

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200

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Overview

Unlock the full potential of your electronic designs with the NCP81080DR2G by Onsemi, a high-quality MOSFET Gate Driver that offers unrivaled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this driver is perfect for a wide range of applications, from automotive to industrial. With its compact size and advanced features, the NCP81080DR2G provides customers with exceptional value, efficiency, and convenience. Say goodbye to limitations and hello to endless possibilities with this cutting-edge gate driver.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the internal components, making it a reliable choice for long-term use.

Surface Mount:

YES - Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage:

20 V - With a high maximum supply voltage, this gate driver can handle a wide range of power requirements, making it versatile for various applications.

Package Shape:

RECTANGULAR - The rectangular shape provides a compact design that can easily fit into tight spaces within an electronic system.

No. of Terminals:

8 - The number of terminals allows for versatile connectivity options, accommodating different circuit configurations.

Package Style (Meter):

SMALL OUTLINE - The small outline package style saves space in a circuit design, ideal for compact electronic devices.

Minimum Supply Voltage:

5.5 V - The low minimum supply voltage ensures compatibility with a range of power sources, making it flexible for different voltage requirements.

Maximum Operating Temperature:

140 °C - The high maximum operating temperature allows for reliable performance in harsh environments or under heavy loads.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature ensures the gate driver can function effectively even in extreme cold conditions.

Terminal Finish:

MATTE TIN - The matte tin finish provides excellent conductivity and corrosion resistance, increasing the longevity of the terminal connections.

Terminal Position:

DUAL - Dual terminal positions offer flexibility in circuit layout and connection orientation, accommodating different design requirements.

Maximum Seated Height:

1.75 mm - The low maximum seated height allows for a slim profile, making it suitable for applications with limited vertical space.

Width:

4.9 mm - The compact width of the gate driver enables easy integration into circuit designs with size constraints.

High Side Driver:

YES - The high side driver capability allows for efficient control of power devices connected to the driver, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s):

30 - The short maximum reflow time ensures quick and effective soldering during assembly, saving time and reducing production costs.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature tolerance ensures reliable soldering connections, even in high-temperature processes.

Length:

3.9 mm - The short length of the gate driver contributes to its compact design, ideal for space-constrained applications.

Temperature Grade:

AUTOMOTIVE - The automotive-grade temperature rating ensures the gate driver can withstand the temperature fluctuations encountered in automotive settings.

Terminal Form:

GULL WING - The gull wing terminal form provides mechanical strength and ease of soldering, ensuring secure and reliable connections.

Maximum Supply Current:

1.6 mA - The low maximum supply current requirement minimizes power consumption, making the gate driver energy-efficient.

Nominal Supply Voltage:

12 V - The nominal supply voltage is commonly used in many electronic systems, ensuring compatibility with standard power sources.

Terminal Pitch:

1.27 mm - The terminal pitch provides ample space for solder connections, reducing the risk of short circuits and ensuring reliable operation.

Interface IC Type:

BUFFER OR INVERTER BASED MOSFET DRIVER - The interface IC type offers versatile control options for MOSFET devices, enhancing the driver's compatibility with different power applications.

Technical Specifications

MOSFET Gate Drivers NCP81080DR2G attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

3.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

140 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

1.6 mA

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.9 mm

Trade Compliance

NCP81080DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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