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NCP81161MNTBG

Onsemi

NCP81161MNTBG by Onsemi

NCP81161MNTBG by Onsemi is a MOSFET gate driver with a max supply voltage of 13.2V and nominal voltage of 5V. It operates in temperatures ranging from -10 to 125°C, making it suitable for high side driver applications. With a small outline package style and dual terminal position, it offers precise control in compact spaces.

Median Price

$0.750

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 854 parts In-Stock

1+ parts

$0.750

100+ parts

$0.240

1k+ parts

$0.176

10k+ parts

$0.147

854

$0.750

$0.240

$0.176

$0.147

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.174

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.174

-

-

-

Bristol Electronics

USA . 648 parts In-Stock

1+ parts

$0.675

100+ parts

$0.250

1k+ parts

$0.189

10k+ parts

-

648

$0.675

$0.250

$0.189

-

Digiode

USA . 1,554 parts In-Stock

1+ parts

$0.712

100+ parts

-

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-

10k+ parts

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1,554

$0.712

-

-

-

Flip Electronics

USA . 84,000 parts In-Stock

1+ parts

-

100+ parts

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84,000

-

-

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Chip Stock

USA . 70,000 parts In-Stock

1+ parts

-

100+ parts

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70,000

-

-

-

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Cyclops Electronics Ltd

UK . 33,366 parts In-Stock

1+ parts

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33,366

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Vyrian

USA . 2,169 parts In-Stock

1+ parts

-

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2,169

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,310 parts In-Stock

1+ parts

$0.174

100+ parts

-

1k+ parts

-

10k+ parts

$0.170

3,310

$0.174

-

-

$0.170

Argo Parts USA

USA . 372 parts In-Stock

1+ parts

$0.174

100+ parts

-

1k+ parts

-

10k+ parts

$0.168

372

$0.174

-

-

$0.168

Corphita

USA . 2,395 parts In-Stock

1+ parts

$0.675

100+ parts

-

1k+ parts

-

10k+ parts

-

2,395

$0.675

-

-

-

Corohmni

South Africa . 98 parts In-Stock

1+ parts

$0.750

100+ parts

-

1k+ parts

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10k+ parts

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98

$0.750

-

-

-

Ampacity Inc.

Singapore . 2,250 parts In-Stock

1+ parts

$1.390

100+ parts

-

1k+ parts

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10k+ parts

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2,250

$1.390

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Perfect Parts

USA . 39,614 parts In-Stock

1+ parts

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39,614

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S.R.D Solutions

India . 17,172 parts In-Stock

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17,172

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SupplyDigital Components

Austria . 7,947 parts In-Stock

1+ parts

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7,947

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Kulean Microsystems

USA . 3,475 parts In-Stock

1+ parts

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3,475

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TANS Electronics

Latvia . 3,383 parts In-Stock

1+ parts

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3,383

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Problanco Electronics

Mexico . 2,699 parts In-Stock

1+ parts

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2,699

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Kepictronics

USA . 1,351 parts In-Stock

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1,351

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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1,000

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UHIMA Technologies

Türkiye . 813 parts In-Stock

1+ parts

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813

-

-

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Futuretech Components

Singapore . 680 parts In-Stock

1+ parts

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680

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Lixinc

USA . 530 parts In-Stock

1+ parts

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1k+ parts

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530

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.170

1k+ parts

$0.165

10k+ parts

$0.162

500

-

$0.170

$0.165

$0.162

Overview

Elevate your electronic designs with the NCP81161MNTBG by Onsemi, a top-of-the-line MOSFET Gate Driver that promises unrivaled quality and performance. Manufactured by industry-leading Onsemi, this innovative product boasts a small outline, heat sink profile, and very thin package style for maximum efficiency. Ideal for a range of applications, this driver ensures optimal power supplies with a supply voltage of 4.5 to 13.2 V. Experience seamless operation in both high and low temperatures, with a wide operating range from -10 to 125°C. Trust Onsemi's expertise and choose the NCP81161MNTBG for superior results in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and thermal properties, ensuring reliable performance and durability.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 13.2 V

High maximum supply voltage allows for compatibility with various power supply systems, increasing flexibility in application.

Package Shape: SQUARE

Square package shape offers efficient use of space on the PCB, enabling compact designs in electronic circuits.

No. of Terminals: 8

Having 8 terminals provides multiple connection points for external components, enabling versatile circuit configurations.

Minimum Operating Temperature: -10 °C

Wide operating temperature range ensures reliable operation in both low and high-temperature environments, increasing product reliability.

Maximum Seated Height: 1 mm

Low seated height minimizes the overall profile of the component, making it suitable for compact electronic devices with space constraints.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Half-bridge based design offers efficient control of MOSFETs, enabling precise switching and regulation in power electronics applications.

Technical Specifications

MOSFET Gate Drivers NCP81161MNTBG attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/13.2

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

13.2 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NCP81161MNTBG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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