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NCP81071BMNTXG

Onsemi

NCP81071BMNTXG by Onsemi

NCP81071BMNTXG by Onsemi is a MOSFET Gate Driver with 2 functions, operating at -40 to 140 °C. It has a supply voltage range of 4.5-20 V and is ideal for automotive applications due to its small outline package and high temperature grade.

Median Price

$1.234

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 11,895 parts In-Stock

1+ parts

$1.520

100+ parts

$0.893

1k+ parts

$0.780

10k+ parts

$0.723

11,895

$1.520

$0.893

$0.780

$0.723

Mouser Electronics

USA . 2,442 parts In-Stock

1+ parts

$1.520

100+ parts

$0.893

1k+ parts

$0.781

10k+ parts

$0.731

2,442

$1.520

$0.893

$0.781

$0.731

Rochester

USA . 12,243 parts In-Stock

1+ parts

-

100+ parts

$0.913

1k+ parts

$0.758

10k+ parts

$0.676

12,243

-

$0.913

$0.758

$0.676

Verical

USA . 11,412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.948

10k+ parts

$0.845

11,412

-

-

$0.948

$0.845

Flip Electronics (Authorized)

USA . 5,023 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,023

-

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,549 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

-

10k+ parts

-

1,549

$0.710

-

-

-

Vyrian

USA . 401 parts In-Stock

1+ parts

$0.747

100+ parts

-

1k+ parts

-

10k+ parts

-

401

$0.747

-

-

-

NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.892

6,000

-

-

-

$0.892

Flip Electronics

USA . 5,023 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,023

-

-

-

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ACDS - Activité Composants Distribution Service

France . 1,814 parts In-Stock

1+ parts

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1,814

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Sensible Micro Corp

USA . 1,035 parts In-Stock

1+ parts

-

100+ parts

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1,035

-

-

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Chip Stock

USA . 725 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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725

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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500

-

-

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Diverse Electronics

Canada . 82 parts In-Stock

1+ parts

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82

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 946 parts In-Stock

1+ parts

$0.672

100+ parts

-

1k+ parts

-

10k+ parts

-

946

$0.672

-

-

-

Corohmni

South Africa . 392 parts In-Stock

1+ parts

$0.707

100+ parts

-

1k+ parts

-

10k+ parts

-

392

$0.707

-

-

-

Ampacity Inc.

Singapore . 7,835 parts In-Stock

1+ parts

$1.380

100+ parts

-

1k+ parts

-

10k+ parts

-

7,835

$1.380

-

-

-

Component Stockers USA

USA . 6,701 parts In-Stock

1+ parts

$1.570

100+ parts

$1.070

1k+ parts

$0.720

10k+ parts

-

6,701

$1.570

$1.070

$0.720

-

Andel Nordic

Denmark . 1,911 parts In-Stock

1+ parts

$1.660

100+ parts

-

1k+ parts

$1.164

10k+ parts

$1.164

1,911

$1.660

-

$1.164

$1.164

Microchip USA

USA . 5,340 parts In-Stock

1+ parts

$5.004

100+ parts

-

1k+ parts

-

10k+ parts

-

5,340

$5.004

-

-

-

Lixinc

USA . 17,725 parts In-Stock

1+ parts

-

100+ parts

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17,725

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-

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Problanco Electronics

Mexico . 7,721 parts In-Stock

1+ parts

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7,721

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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TANS Electronics

Latvia . 3,288 parts In-Stock

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3,288

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Assy Fe

Spain . 2,445 parts In-Stock

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2,445

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SupplyDigital Components

Austria . 2,317 parts In-Stock

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2,317

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Kulean Microsystems

USA . 905 parts In-Stock

1+ parts

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905

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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500

-

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UHIMA Technologies

Türkiye . 104 parts In-Stock

1+ parts

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100+ parts

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104

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-

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-

Overview

Elevate your projects with the NCP81071BMNTXG MOSFET Gate Driver by Onsemi. Crafted with precision and quality in mind, this driver offers unparalleled performance and reliability. Ideal for automotive applications and beyond, this driver boasts a sleek package design and a wide operating temperature range. Say goodbye to compromises and hello to seamless integration with this versatile and innovative product. Trust Onsemi to deliver excellence every time. Elevate your designs with the NCP81071BMNTXG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the gate driver.

Surface Mount: YES

Being surface mountable makes the installation of this gate driver easy and efficient, saving space on the PCB.

Maximum Supply Voltage: 20 V

With a high maximum supply voltage of 20 V, this gate driver can be used in a wide range of applications.

No. of Functions: 2

Having 2 functions in one device simplifies the design and reduces component count, making the overall system more cost-effective.

Package Shape: SQUARE

The square package shape allows for easy integration into the PCB layout and provides a compact footprint.

Power Supplies (V): 12

The nominal supply voltage of 12 V makes this gate driver compatible with standard power supply voltages, simplifying the power management system.

No. of Terminals: 8

With 8 terminals, this gate driver offers flexibility in connectivity options and allows for easy interfacing with other components.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style contribute to efficient heat dissipation and space-saving on the PCB.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5 V ensures compatibility with a wide range of power sources and enhances the versatility of the gate driver.

Maximum Operating Temperature: 140 °C

The high maximum operating temperature of 140°C allows the gate driver to operate reliably in harsh environments and high-temperature conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the gate driver can operate effectively in cold environments without any performance degradation.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good conductivity and solderability, ensuring a reliable electrical connection.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and easy connection to external circuits.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8 mm enables a compact design and minimizes the overall height of the PCB assembly.

Width: 3 mm

The narrow width of 3 mm enables the gate driver to fit into tight spaces on the PCB, improving overall layout flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 30 seconds ensures proper soldering and reliable connections during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables proper soldering of the gate driver during the manufacturing process.

Length: 3 mm

The compact length of 3 mm contributes to a space-saving design and allows for efficient placement on the PCB.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures the gate driver can withstand the harsh operating conditions found in automotive applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and improves reliability by eliminating potential solder joint failures.

Nominal Supply Voltage: 12 V

The 12 V nominal supply voltage is a common standard in many applications, making this gate driver widely compatible and easy to integrate.

Terminal Pitch: 0.65 mm

The narrow terminal pitch of 0.65 mm allows for high-density mounting and compact PCB layouts, maximizing space efficiency.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

The buffer or inverter-based MOSFET driver interface IC type offers flexibility in driving MOSFETs and ensures compatibility with various control circuits.

Technical Specifications

MOSFET Gate Drivers NCP81071BMNTXG attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

NO

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

140 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC8,.12SQ,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NCP81071BMNTXG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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