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NCP81381MNTXG

Onsemi

NCP81381MNTXG by Onsemi

BUFFER OR INVERTER BASED MOSFET DRIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HQCCN; Package Shape: RECTANGULAR;

Median Price

$1.398

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,439,386 parts In-Stock

1+ parts

-

100+ parts

$1.370

1k+ parts

$1.140

10k+ parts

$1.010

1,439,386

-

$1.370

$1.140

$1.010

Verical

USA . 1,436,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.425

10k+ parts

$1.262

1,436,875

-

-

$1.425

$1.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 320 parts In-Stock

1+ parts

$0.600

100+ parts

-

1k+ parts

-

10k+ parts

-

320

$0.600

-

-

-

DF Sales Co.

USA . 320 parts In-Stock

1+ parts

$0.600

100+ parts

-

1k+ parts

-

10k+ parts

-

320

$0.600

-

-

-

Digiode

USA . 1,645 parts In-Stock

1+ parts

$1.064

100+ parts

-

1k+ parts

-

10k+ parts

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1,645

$1.064

-

-

-

Vyrian

USA . 6,884 parts In-Stock

1+ parts

-

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6,884

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-

-

-

Component Sense

UK . 3,395 parts In-Stock

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-

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3,395

-

-

-

-

Conversion2

USA . 395 parts In-Stock

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395

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Sunrise Surplus Inc.

USA . 30 parts In-Stock

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30

-

-

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Electronics Depot

USA . 4 parts In-Stock

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4

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-

Distributors (Availability)

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Corohmni

South Africa . 200 parts In-Stock

1+ parts

$0.600

100+ parts

-

1k+ parts

-

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200

$0.600

-

-

-

Vigor

Singapore . 407 parts In-Stock

1+ parts

$0.940

100+ parts

-

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407

$0.940

-

-

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Corphita

USA . 652 parts In-Stock

1+ parts

$1.008

100+ parts

-

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652

$1.008

-

-

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AZTECH Wire

Italy . 80 parts In-Stock

1+ parts

$16.580

100+ parts

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80

$16.580

-

-

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Continental Prestige Electronics

USA . 1,618,791 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.812

10k+ parts

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1,618,791

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-

$0.812

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QUARKTWIN TECHNOLOGY LTD

USA . 9,668 parts In-Stock

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9,668

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SupplyDigital Components

Austria . 6,780 parts In-Stock

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6,780

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-

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A-Z Elektronik GmbH

Germany . 6,647 parts In-Stock

1+ parts

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6,647

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-

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TANS Electronics

Latvia . 6,197 parts In-Stock

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6,197

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-

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Kulean Microsystems

USA . 4,940 parts In-Stock

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4,940

-

-

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Problanco Electronics

Mexico . 4,433 parts In-Stock

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4,433

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Metaverse IC Inc.

Canada . 769 parts In-Stock

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769

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ChipstoGo Electronic ltd

UK . 669 parts In-Stock

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669

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Kepictronics

USA . 480 parts In-Stock

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480

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Microchip USA

USA . 402 parts In-Stock

1+ parts

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402

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UHIMA Technologies

Türkiye . 152 parts In-Stock

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152

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Technical Specifications

MOSFET Gate Drivers NCP81381MNTXG attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

YES

JESD-30 Code:

R-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-10 Cel

Nominal Output Peak Current Limit:

60 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.16X.24,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

NCP81381MNTXG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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