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NCP5890MUTXG

Onsemi

NCP5890MUTXG by Onsemi

NCP5890MUTXG by Onsemi is a Graphics Display Driver with SERIAL data input mode, 16 terminals, and 3/5V power supplies. It operates in industrial temperature range (-40 to 85 °C) and uses BICMOS technology. Ideal for LED display driver applications due to its compact square package shape and low profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,608 parts In-Stock

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7,608

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Flip Electronics

USA . 3,000 parts In-Stock

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3,000

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Digiode

USA . 1,231 parts In-Stock

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1,231

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A&K Electronics

USA . 461 parts In-Stock

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461

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Bristol Electronics

USA . 392 parts In-Stock

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392

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Distributors (Availability)

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AZTECH Wire

Italy . 778 parts In-Stock

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$14.520

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778

$14.520

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Perfect Parts

USA . 15,960 parts In-Stock

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15,960

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TANS Electronics

Latvia . 6,382 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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GreenTree Electronics

Israel . 2,800 parts In-Stock

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2,800

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Kulean Microsystems

USA . 1,946 parts In-Stock

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1,946

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Problanco Electronics

Mexico . 971 parts In-Stock

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971

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Corphita

USA . 800 parts In-Stock

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800

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Microchip USA

USA . 479 parts In-Stock

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479

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UHIMA Technologies

Türkiye . 446 parts In-Stock

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Corohmni

South Africa . 285 parts In-Stock

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SupplyDigital Components

Austria . 87 parts In-Stock

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Overview

Elevate your display experience with the NCP5890MUTXG by Onsemi, a top-tier manufacturer known for their high-quality graphics display drivers. This sleek and compact chip carrier marvel offers seamless data input via serial mode, ensuring easy integration into various applications. Whether you're looking to enhance LED displays or drive multiple segments with precision, this industrial-grade solution delivers exceptional value and performance. Say hello to crystal-clear visuals and reliable operation with the NCP5890MUTXG - your ultimate display driver companion.

Feature Benefit Bullets

Data Input Mode: SERIAL

Serial data input mode allows for easy communication and control, enhancing flexibility and connectivity options.

Surface Mount: YES

Surface mount capability simplifies the installation process and saves space, making it ideal for compact applications.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage ensures compatibility with a wide range of systems and devices, offering versatility in use.

Package Shape: SQUARE

Square package shape provides a compact design and efficient use of board space, contributing to a streamlined and organized layout.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies allows for compatibility with various power sources, enhancing flexibility in design and implementation.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options and interfaces, facilitating smooth integration and communication within the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer versatility in mounting options and thermal management, ensuring optimal performance and reliability in different environments.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage ensures efficient power consumption and operation, making it suitable for energy-conscious applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance enables reliable performance in challenging environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for usage in extreme conditions, making it suitable for rugged and industrial applications.

Terminal Finish: TIN

Tin terminal finish ensures good conductivity, corrosion resistance, and solderability, enhancing the durability and longevity of the product.

Terminal Position: QUAD

Quad terminal position offers convenient placement and connection, facilitating easier integration and maintenance of the device.

Maximum Seated Height: 0.6 mm

Low maximum seated height minimizes the overall profile and footprint of the component, enabling compact and space-efficient designs.

Width: 3 mm

Narrow width dimension provides compatibility with various board sizes and layouts, allowing for versatile and flexible installation.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering process and component attachment, contributing to robust assembly quality.

Length: 3 mm

Compact length dimension complements the narrow width, resulting in a small form factor that optimizes space usage and design efficiency.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures operation in harsh environments and industrial settings, providing ruggedness and reliability.

Technology: BICMOS

BICMOS technology offers a combination of bipolar and CMOS features, providing high-speed performance, low power consumption, and reliable operation.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes sustainability, making it a more environmentally friendly choice.

Nominal Supply Voltage: 3.6 V

Stable nominal supply voltage ensures consistent and reliable operation, contributing to the overall performance and longevity of the product.

No. of Segments: 6

Having 6 segments allows for handling and display of multiple data segments simultaneously, enhancing the visual information and output clarity.

Terminal Pitch: 0.5 mm

Fine terminal pitch provides precise connectivity and mounting options, enabling high-density integration and space-saving design solutions.

Minimum fmax: 0.4 MHz

Low minimum fmax frequency ensures efficient operation and fast data processing, supporting high-speed applications and real-time data handling.

Interface IC Type: LED DISPLAY DRIVER

Specifying LED display driver interface IC type indicates compatibility and optimized performance for driving LED displays, ensuring clear and vibrant visual output.

Technical Specifications

Graphics Display Drivers NCP5890MUTXG attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

6

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Minimum fmax:

.4 MHz

Trade Compliance

NCP5890MUTXG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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