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NCP5623MUTBG

Onsemi

NCP5623MUTBG by Onsemi

NCP5623MUTBG by Onsemi is a graphics display driver with serial data input mode, operating voltage range of 2.7V to 5.5V, and industrial temperature grade. It comes in a square chip carrier package style with 12 terminals and is suitable for LED display driver applications requiring low power consumption and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 62,000 parts In-Stock

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62,000

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Vyrian

USA . 3,045 parts In-Stock

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3,045

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Digiode

USA . 2,247 parts In-Stock

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2,247

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,049 parts In-Stock

1+ parts

$4.480

100+ parts

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2,049

$4.480

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AZTECH Wire

Italy . 414 parts In-Stock

1+ parts

$13.560

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414

$13.560

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Ampacity Inc.

Singapore . 340 parts In-Stock

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$40.500

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340

$40.500

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Semicontronic

India . 1,621 parts In-Stock

1+ parts

$48.500

100+ parts

$47.288

1k+ parts

$47.045

10k+ parts

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1,621

$48.500

$47.288

$47.045

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TANS Electronics

Latvia . 6,888 parts In-Stock

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6,888

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Continental Prestige Electronics

USA . 6,137 parts In-Stock

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6,137

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SupplyDigital Components

Austria . 4,974 parts In-Stock

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4,974

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Problanco Electronics

Mexico . 2,195 parts In-Stock

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2,195

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Kulean Microsystems

USA . 1,779 parts In-Stock

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1,779

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Argo Parts USA

USA . 423 parts In-Stock

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423

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Microchip USA

USA . 415 parts In-Stock

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415

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Vigor

Singapore . 205 parts In-Stock

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205

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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UHIMA Technologies

Türkiye . 106 parts In-Stock

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106

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Corphita

USA . 77 parts In-Stock

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77

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Corohmni

South Africa . 74 parts In-Stock

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74

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Overview

Elevate your graphics display experience with the NCP5623MUTBG from Onsemi. This cutting-edge LED display driver offers unparalleled quality and reliability, thanks to its industry-leading manufacturer. Perfect for a wide range of applications, this product brings value and benefits to customers through its efficient power management and ease of use. Say goodbye to technical headaches and hello to seamless performance with the NCP5623MUTBG by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection to the graphics display driver, ensuring a longer lifespan.

Data Input Mode: SERIAL

Serial data input mode allows for efficient communication and data transfer between the graphics display driver and the connected devices.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage of 5.5 V allows for flexibility in power supply options, accommodating various system requirements.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage of 2.7 V ensures efficient power utilization and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85°C

High maximum operating temperature of 85°C ensures reliable performance even under challenging environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the reliability and longevity of the product.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the graphics display driver can operate effectively in industrial settings with varying temperature conditions.

Width: 2 mm

Compact width of 2 mm enables space-saving installation and integration of the graphics display driver in devices with limited space.

Minimum fmax: 0.4 MHz

Low minimum fmax of 0.4 MHz indicates high speed and efficiency in driving LED displays, ensuring smooth and crisp visual output.

Technical Specifications

Graphics Display Drivers NCP5623MUTBG attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

2 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

3

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC12(UNSPEC)

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

2 mm

Minimum fmax:

.4 MHz

Trade Compliance

NCP5623MUTBG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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