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NCP5623AMUTBG

Onsemi

NCP5623AMUTBG by Onsemi

NCP5623AMUTBG by Onsemi is a graphics display driver with serial data input mode, suitable for LED displays. It operates b/w -40 to 85 °C with supply voltage range of 2.7V to 5.5V. This chip carrier package has 12 terminals and supports multiplexed display capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,129 parts In-Stock

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4,129

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Digiode

USA . 1,074 parts In-Stock

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1,074

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Vigor

Singapore . 769 parts In-Stock

1+ parts

$0.600

100+ parts

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769

$0.600

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Aztec Data Supply Inc.

USA . 191 parts In-Stock

1+ parts

$3.040

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191

$3.040

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AZTECH Wire

Italy . 366 parts In-Stock

1+ parts

$14.926

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366

$14.926

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Ampacity Inc.

Singapore . 1,547 parts In-Stock

1+ parts

$35.500

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1,547

$35.500

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Semicontronic

India . 602 parts In-Stock

1+ parts

$45.500

100+ parts

$44.362

1k+ parts

$44.135

10k+ parts

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602

$45.500

$44.362

$44.135

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TANS Electronics

Latvia . 8,061 parts In-Stock

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8,061

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Argo Parts USA

USA . 3,939 parts In-Stock

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3,939

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SupplyDigital Components

Austria . 2,623 parts In-Stock

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2,623

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Continental Prestige Electronics

USA . 2,023 parts In-Stock

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2,023

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Problanco Electronics

Mexico . 2,007 parts In-Stock

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2,007

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Corphita

USA . 1,664 parts In-Stock

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1,664

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UHIMA Technologies

Türkiye . 811 parts In-Stock

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811

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Microchip USA

USA . 392 parts In-Stock

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392

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Corohmni

South Africa . 274 parts In-Stock

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274

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Kulean Microsystems

USA . 80 parts In-Stock

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80

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Overview

Enhance your display experience with the NCP5623AMUTBG by Onsemi, a top-tier manufacturer known for their quality products. Ideal for graphics display drivers, this versatile chip carrier offers seamless serial data input mode and multiplexed display capability. With a wide operating temperature range and industrial-grade durability, this driver provides reliable performance in various applications. Elevate your designs with the value and benefits of the NCP5623AMUTBG, delivering superior functionality and efficiency to meet your display driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and long lasting performance of the product.

Data Input Mode: SERIAL

Serial data input mode allows for efficient and organized data transmission, making it easy to integrate with various systems.

Surface Mount: YES

Surface mount capability makes installation and maintenance of the product easy and convenient.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in usage.

Package Shape: SQUARE

Square package shape enables easy stacking and placement in electronic devices, optimizing space utilization.

No. of Terminals: 12

Having 12 terminals allows for versatile connectivity options, enhancing compatibility with different display systems.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage ensures efficient power consumption, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the product to function effectively in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal position allows for stable and secure connectivity, minimizing the risk of connection issues.

Maximum Seated Height: 0.6 mm

Low maximum seated height enables compact design and easy integration into slim electronic devices.

Width: 2 mm

Small width dimension allows for space-saving installation in tight electronic setups.

Length: 2 mm

Compact length dimension further enhances space efficiency when incorporating the product into electronic devices.

Multiplexed Display Capability: YES

Multiplexed display capability enables the product to manage and control multiple display segments efficiently, providing versatile display options.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand rugged operating conditions, making it suitable for industrial applications.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with modern regulations on hazardous substances in electronics.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V provides stable and optimal power input for reliable performance.

No. of Segments: 3

Having 3 segments allows for segmented display options, providing flexibility in designing various visual outputs.

Terminal Pitch: 0.4 mm

Narrow terminal pitch enhances connectivity density, enabling compact design and efficient signal transmission.

Minimum fmax: 0.4 MHz

Low minimum fmax value of 0.4 MHz ensures high-speed data processing capabilities, enabling quick and responsive display functions.

Interface IC Type: LED DISPLAY DRIVER

LED display driver interface IC type ensures compatibility with LED display systems, allowing for seamless integration and optimal performance.

Technical Specifications

Graphics Display Drivers NCP5623AMUTBG attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

YES

No. of Functions:

1

No. of Segments:

3

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

2 mm

Minimum fmax:

.4 MHz

Trade Compliance

NCP5623AMUTBG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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