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NCP5602MUTBG

Onsemi

NCP5602MUTBG by Onsemi

NCP5602MUTBG by Onsemi is a graphics display driver with serial data input mode and 12 terminals. It operates b/w -40 to 85 °C, suitable for industrial applications. The chip carrier package has a square shape, very thin profile, and nickel/palladium/gold terminal finish.

Median Price

$0.686

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 172,263 parts In-Stock

1+ parts

-

100+ parts

$0.674

1k+ parts

$0.559

10k+ parts

$0.498

172,263

-

$0.674

$0.559

$0.498

Verical

USA . 149,170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.699

10k+ parts

$0.623

149,170

-

-

$0.699

$0.623

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,105 parts In-Stock

1+ parts

$0.524

100+ parts

-

1k+ parts

-

10k+ parts

-

2,105

$0.524

-

-

-

Vyrian

USA . 6,899 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,899

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 341 parts In-Stock

1+ parts

$0.497

100+ parts

-

1k+ parts

-

10k+ parts

-

341

$0.497

-

-

-

Vigor

Singapore . 459 parts In-Stock

1+ parts

$0.530

100+ parts

-

1k+ parts

-

10k+ parts

-

459

$0.530

-

-

-

Corohmni

South Africa . 306 parts In-Stock

1+ parts

$0.552

100+ parts

-

1k+ parts

-

10k+ parts

-

306

$0.552

-

-

-

AZTECH Wire

Italy . 778 parts In-Stock

1+ parts

$13.140

100+ parts

-

1k+ parts

-

10k+ parts

-

778

$13.140

-

-

-

Continental Prestige Electronics

USA . 152,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.525

10k+ parts

-

152,373

-

-

$0.525

-

TANS Electronics

Latvia . 6,567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,567

-

-

-

-

Problanco Electronics

Mexico . 5,126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,126

-

-

-

-

Microchip USA

USA . 4,858 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,858

-

-

-

-

Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Kulean Microsystems

USA . 2,174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,174

-

-

-

-

UHIMA Technologies

Türkiye . 437 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

437

-

-

-

-

SupplyDigital Components

Austria . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

350

-

-

-

-

Overview

Experience high-quality performance and reliability with the NCP5602MUTBG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge graphics display drivers that are perfect for a wide range of applications. With its advanced features and innovative design, this product offers customers unmatched value, benefits, and advantages. Whether you're looking to enhance your LED display driver or upgrade your current system, the NCP5602MUTBG is the perfect solution for all your needs. Elevate your projects to the next level with Onsemi's top-of-the-line technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and reliability for long-term use, while epoxy offers strong adhesion and moisture resistance.

Data Input Mode: SERIAL

Serial data input mode allows for easy integration with a wide range of systems and devices, making it versatile and user-friendly.

Surface Mount: YES

Surface mount capability enables easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage ensures compatibility with various power sources, increasing flexibility and usability.

Package Shape: SQUARE

Square package shape provides a compact form factor, ideal for space-constrained applications and easy PCB layout.

No. of Terminals: 12

Having 12 terminals allows for versatile connectivity options, enabling seamless integration with different components and systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Incorporating chip carrier and heat sink/slug design along with a very thin profile enhances thermal management and overall performance.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature capability ensures reliability and performance in various environmental conditions, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables reliable performance in extreme conditions, enhancing durability and usability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold terminal finish offers excellent conductivity, corrosion resistance, and solderability for long-lasting and reliable connections.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections, ensuring consistent performance and reliability in various applications.

Maximum Seated Height: 0.6 mm

Low maximum seated height offers compact and slim profile for space-saving design and easy integration in tight spaces.

Width: 2 mm

Narrow width dimension facilitates compact and efficient PCB layout, saving space and enabling seamless integration in small devices.

Maximum Time At Peak Reflow Temperature (s): 40

Optimal time at peak reflow temperature ensures proper soldering and assembly, enhancing product reliability and performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures effective soldering and assembly, ensuring strong and reliable connections for long-term use.

Length: 2 mm

Short length dimension offers a compact and space-efficient design, ideal for small and portable electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments, making it suitable for rugged applications.

Terminal Form: NO LEAD

No-lead terminal form complies with environmental regulations and offers safe and sustainable operation, reducing the environmental impact.

Nominal Supply Voltage: 3.6 V

Stable nominal supply voltage ensures consistent and reliable performance, enhancing product longevity and usability.

No. of Segments: 2

Having 2 segments allows for easy and efficient display control, providing clear and precise information in various applications.

Terminal Pitch: 0.4 mm

Small terminal pitch enables precise and secure connections, ensuring stable operation and performance in demanding conditions.

Interface IC Type: LED DISPLAY DRIVER

LED display driver interface IC type offers efficient and reliable control of LED displays, providing high-quality visual output in electronic devices.

Technical Specifications

Graphics Display Drivers NCP5602MUTBG attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

2 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

2

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

2 mm

Trade Compliance

NCP5602MUTBG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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