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NCP5006SNT1

Onsemi

NCP5006SNT1 by Onsemi

NCP5006SNT1 by Onsemi is a Graphics Display Driver with 5.5V max supply voltage, suitable for LED display drivers. It operates b/w -25 to 85 °C and has a small outline package style with 5 terminals in gull wing form.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 33,500 parts In-Stock

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33,500

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Vyrian

USA . 5,572 parts In-Stock

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5,572

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Digiode

USA . 819 parts In-Stock

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819

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 95 parts In-Stock

1+ parts

$8.992

100+ parts

$8.183

1k+ parts

$7.373

10k+ parts

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95

$8.992

$8.183

$7.373

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AZTECH Wire

Italy . 1,152 parts In-Stock

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$20.000

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1,152

$20.000

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TANS Electronics

Latvia . 8,310 parts In-Stock

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8,310

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SupplyDigital Components

Austria . 6,676 parts In-Stock

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6,676

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Problanco Electronics

Mexico . 2,296 parts In-Stock

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2,296

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Corphita

USA . 1,519 parts In-Stock

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Kulean Microsystems

USA . 969 parts In-Stock

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Vigor

Singapore . 498 parts In-Stock

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498

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Microchip USA

USA . 156 parts In-Stock

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UHIMA Technologies

Türkiye . 121 parts In-Stock

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121

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Corohmni

South Africa . 83 parts In-Stock

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Overview

Enhance your graphic display applications with the NCP5006SNT1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that meet the highest standards. The NCP5006SNT1 offers unparalleled value, providing customers with reliable performance and efficiency. Whether you're designing LED displays or other visual interfaces, this product is the perfect solution for your needs. Trust Onsemi to deliver cutting-edge technology that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the graphics display driver, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage tolerance allows for flexibility in power supply options, accommodating a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape enables space-saving installation and integration into various electronic devices or systems.

Power Supplies (V): 3/5

Dual power supply options provide compatibility with different voltage requirements, enhancing the versatility of the graphics display driver.

No. of Terminals: 5

The number of terminals allows for reliable connectivity and communication between the graphics display driver and other components in the system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style offers space-efficient design possibilities, ideal for compact electronic devices with limited space.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement ensures efficient power consumption and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable performance even in demanding environmental conditions or extended usage.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature rating allows for reliable functionality in cold environments or during start-up conditions.

Terminal Finish: TIN LEAD

The tin lead finish on the terminals provides good solderability and conductivity for secure and stable connections during assembly.

Terminal Position: DUAL

Dual terminal positions enable flexible installation options and compatibility with different circuit board layouts, enhancing usability.

Maximum Seated Height: 1.1 mm

The compact seated height allows for low-profile installation and integration into thin electronic devices or systems.

Width: 1.5 mm

The slim width of the graphics display driver contributes to space-saving design possibilities and compatibility with compact layouts.

Peak Reflow Temperature °C: 235

The high peak reflow temperature tolerance ensures reliable and stable soldering during manufacturing processes, preventing solder joint failure.

Length: 3 mm

The short length of the graphics display driver allows for compact and efficient placement within electronic assemblies or devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates secure mounting and connection during soldering processes, enhancing durability and stability.

Nominal Supply Voltage: 3.6 V

The nominal supply voltage provides a standard operating voltage for consistent performance and compatibility with various applications.

Terminal Pitch: 0.95 mm

The narrow terminal pitch enables dense packing and efficient use of space on circuit boards, enhancing the compactness of the overall design.

Interface IC Type: LED DISPLAY DRIVER

The specific interface IC type for LED display drivers indicates compatibility with LED-based display systems, ensuring optimal performance and functionality.

Technical Specifications

Graphics Display Drivers NCP5006SNT1 attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.5 mm

Trade Compliance

NCP5006SNT1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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