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NCP5369MNR2G

Onsemi

NCP5369MNR2G by Onsemi

NCP5369MNR2G by Onsemi is a MOSFET gate driver with 25V max supply voltage, 5-12V power supplies, and -10 to 100°C operating temp. Ideal for high side driver applications in various industries due to its compact square package shape and quad terminal position.

Median Price

$1.394

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19,900 parts In-Stock

1+ parts

-

100+ parts

$1.200

1k+ parts

$1.070

10k+ parts

$1.010

19,900

-

$1.200

$1.070

$1.010

Verical

USA . 19,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.587

10k+ parts

$1.413

19,900

-

-

$1.587

$1.413

Element14

Singapore . 2,070 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,070

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,179 parts In-Stock

1+ parts

$1.264

100+ parts

-

1k+ parts

-

10k+ parts

-

1,179

$1.264

-

-

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$1.803

100+ parts

-

1k+ parts

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15

$1.803

-

-

-

Flip Electronics

USA . 7,500 parts In-Stock

1+ parts

-

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7,500

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-

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Vyrian

USA . 7,337 parts In-Stock

1+ parts

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7,337

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-

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Cyclops Electronics Ltd

UK . 2,945 parts In-Stock

1+ parts

-

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2,945

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-

-

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IBS Electronics

USA . 2,415 parts In-Stock

1+ parts

-

100+ parts

$1.688

1k+ parts

$1.489

10k+ parts

$1.411

2,415

-

$1.688

$1.489

$1.411

Ashlea Components Ltd

UK . 602 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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602

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,479 parts In-Stock

1+ parts

$1.120

100+ parts

-

1k+ parts

-

10k+ parts

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9,479

$1.120

-

-

-

Corphita

USA . 1,141 parts In-Stock

1+ parts

$1.197

100+ parts

-

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10k+ parts

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1,141

$1.197

-

-

-

Corohmni

South Africa . 236 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

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236

$1.330

-

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Argo Parts USA

USA . 3,624 parts In-Stock

1+ parts

$1.803

100+ parts

-

1k+ parts

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10k+ parts

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3,624

$1.803

-

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Continental Prestige Electronics

USA . 2,440 parts In-Stock

1+ parts

$1.803

100+ parts

-

1k+ parts

-

10k+ parts

$1.767

2,440

$1.803

-

-

$1.767

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.803

100+ parts

-

1k+ parts

$1.713

10k+ parts

$1.677

2,000

$1.803

-

$1.713

$1.677

AZTECH Wire

Italy . 139 parts In-Stock

1+ parts

$20.980

100+ parts

-

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139

$20.980

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RC Electronics

USA . 34,600 parts In-Stock

1+ parts

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34,600

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Lixinc

USA . 17,610 parts In-Stock

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17,610

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SupplyDigital Components

Austria . 7,565 parts In-Stock

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7,565

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TANS Electronics

Latvia . 5,740 parts In-Stock

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5,740

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Kulean Microsystems

USA . 5,302 parts In-Stock

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5,302

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Problanco Electronics

Mexico . 4,310 parts In-Stock

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4,310

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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A-Z Elektronik GmbH

Germany . 2,777 parts In-Stock

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2,777

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Futuretech Components

Singapore . 2,500 parts In-Stock

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2,500

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Microchip USA

USA . 370 parts In-Stock

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370

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UHIMA Technologies

Türkiye . 6 parts In-Stock

1+ parts

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6

-

-

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-

Overview

Unlock the potential of your power supply systems with the NCP5369MNR2G MOSFET Gate Driver by Onsemi. Designed for reliability and high performance, this surface mount driver offers a maximum supply voltage of 25V and a wide range of power supplies from 5V to 12V. With its advanced features and exceptional quality, this driver is ideal for a variety of applications in industries such as automotive, industrial, and telecommunications. Experience seamless operation and improved efficiency with the NCP5369MNR2G, providing you with the value and benefits you need to take your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 25 V

Ability to handle high voltage inputs makes this gate driver suitable for a wide range of applications.

Package Shape: SQUARE

Square package shape provides a compact and efficient design, saving space on the PCB.

Power Supplies (V): 5,12

Support for multiple power supply options allows for flexibility in system design.

No. of Terminals: 40

Large number of terminals provide connectivity options for various components in the circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer versatility in mounting and thermal management options.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliability in harsh environments.

Minimum Operating Temperature: -10 °C

Wide temperature range allows for operation in both low and high-temperature conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position offers stable connection for efficient signal transmission.

Maximum Seated Height: 1 mm

Low seated height allows for a compact and space-saving design on the PCB.

Width: 6 mm

Narrow width enables the gate driver to fit in tight spaces and compact layouts.

High Side Driver: YES

High side driver capability enables efficient control of high side power MOSFETs in the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures quick and efficient soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures solder joints are strong and reliable.

Length: 6 mm

Compact length allows for a space-efficient layout on the PCB.

Terminal Form: NO LEAD

No-lead terminal form simplifies the soldering process and enhances connection reliability.

Nominal Supply Voltage: 12 V

Stable nominal supply voltage ensures consistent performance in the system.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the gate driver can withstand moderate exposure to moisture during storage and assembly.

Interface IC Type: AND GATE BASED MOSFET DRIVER

AND gate based interface IC enhances efficiency and reliability in controlling MOSFETs in the circuit.

Technical Specifications

MOSFET Gate Drivers NCP5369MNR2G attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,12

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

NCP5369MNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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