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NCP51530BDR2G

Onsemi

NCP51530BDR2G by Onsemi

NCP51530BDR2G by Onsemi is a MOSFET gate driver with 17V max supply voltage, 10V min supply voltage, and 3.5A nominal output peak current limit. Ideal for automotive applications due to its high side driver feature and -40°C to 125°C operating temperature range. Compact in size with small outline package style for surface mount assembly.

Median Price

$1.350

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 9,815 parts In-Stock

1+ parts

$1.350

100+ parts

$0.751

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-

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9,815

$1.350

$0.751

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DigiKey

USA . 737 parts In-Stock

1+ parts

$1.350

100+ parts

$0.786

1k+ parts

$0.698

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737

$1.350

$0.786

$0.698

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Newark

USA . 216 parts In-Stock

1+ parts

$1.350

100+ parts

$0.786

1k+ parts

$0.684

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216

$1.350

$0.786

$0.684

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Farnell

UK . 2,424 parts In-Stock

1+ parts

$1.830

100+ parts

$0.761

1k+ parts

$0.600

10k+ parts

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2,424

$1.830

$0.761

$0.600

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Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

$2.070

100+ parts

$0.774

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2,500

$2.070

$0.774

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Arrow

USA . 10,000 parts In-Stock

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$0.596

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$0.596

Verical

USA . 10,000 parts In-Stock

1+ parts

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$0.589

10,000

-

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$0.589

RS (Exports)

UK . 1 parts In-Stock

1+ parts

-

100+ parts

$1.064

1k+ parts

$0.762

10k+ parts

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1

-

$1.064

$0.762

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 150 parts In-Stock

1+ parts

$1.349

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150

$1.349

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Nova Conductors

Japan . 76 parts In-Stock

1+ parts

$1.497

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76

$1.497

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Sensible Micro Corp

USA . 10,284 parts In-Stock

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Vyrian

USA . 4,893 parts In-Stock

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Bristol Electronics

USA . 2,569 parts In-Stock

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2,569

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Chip Stock

USA . 771 parts In-Stock

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771

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 56 parts In-Stock

1+ parts

$0.639

100+ parts

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56

$0.639

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Semicontronic

India . 4,830 parts In-Stock

1+ parts

$0.840

100+ parts

$0.819

1k+ parts

$0.815

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4,830

$0.840

$0.819

$0.815

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Ampacity Inc.

Singapore . 4,485 parts In-Stock

1+ parts

$0.840

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4,485

$0.840

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Corphita

USA . 780 parts In-Stock

1+ parts

$1.278

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780

$1.278

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$1.467

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$1.409

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2,000

$1.467

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$1.409

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Argo Parts USA

USA . 3,709 parts In-Stock

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$1.497

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3,709

$1.497

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Continental Prestige Electronics

USA . 1,815 parts In-Stock

1+ parts

$1.497

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$1.467

1,815

$1.497

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$1.467

Vigor

Singapore . 500 parts In-Stock

1+ parts

$1.970

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500

$1.970

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Aztec Data Supply Inc.

USA . 48,620 parts In-Stock

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$9.620

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$9.620

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Microchip USA

USA . 4,379 parts In-Stock

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$16.120

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Lixinc

USA . 9,687 parts In-Stock

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SupplyDigital Components

Austria . 6,742 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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TANS Electronics

Latvia . 5,381 parts In-Stock

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Problanco Electronics

Mexico . 4,986 parts In-Stock

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Kulean Microsystems

USA . 1,382 parts In-Stock

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iodParts Technologies Inc.

India . 1,091 parts In-Stock

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UHIMA Technologies

Türkiye . 381 parts In-Stock

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381

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Overview

Unleash the power of your electronics with the NCP51530BDR2G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their MOSFET Gate Drivers. Perfect for automotive applications, this driver offers fast turn-on and turn-off times, nominal output peak current limit of 3.5 A, and a small outline package style for easy integration. Elevate your projects with the NCP51530BDR2G and experience unmatched performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and ensures protection for the internal components, making this product a reliable choice.

Surface Mount: YES

The surface mount feature allows for easy installation onto a circuit board, making this product convenient and suitable for automated assembly processes.

Maximum Supply Voltage: 17 V

With a high maximum supply voltage, this gate driver can be used in a wide range of applications, providing flexibility and versatility.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient utilization of space on the circuit board, making this product compact and ideal for applications with limited space.

No. of Terminals: 8

The presence of 8 terminals allows for a secure and stable connection to other components, ensuring reliable performance of the gate driver.

Package Style: SMALL OUTLINE

The small outline package style minimizes the footprint of the gate driver, making it suitable for compact designs and space-constrained applications.

Minimum Supply Voltage: 10 V

With a low minimum supply voltage requirement, this gate driver can operate effectively in low-power applications, offering energy efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance ensures that the gate driver can function reliably even in elevated temperature environments, enhancing its durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables the gate driver to operate efficiently in cold conditions, making it suitable for a variety of environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring a secure and reliable electrical connection, making this product a durable choice.

Technical Specifications

MOSFET Gate Drivers NCP51530BDR2G attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

3.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

3.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

2.5 mA

Maximum Supply Voltage:

17 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

40 us

Turn-on Time:

40 us

Width:

4.9 mm

Trade Compliance

NCP51530BDR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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