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NCP51530BMNTWG

Onsemi

NCP51530BMNTWG by Onsemi

NCP51530BMNTWG by Onsemi is a MOSFET gate driver with a supply voltage range of 10-17V, suitable for automotive applications. It features a high side driver, turn-on/off time of 40us, and output peak current limit of 3.5A. The package style is small outline with very thin profile, making it ideal for space-constrained designs.

Median Price

$1.240

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6,558 parts In-Stock

1+ parts

$1.540

100+ parts

$0.907

1k+ parts

$0.811

10k+ parts

$0.742

6,558

$1.540

$0.907

$0.811

$0.742

DigiKey

USA . 3,607 parts In-Stock

1+ parts

$1.540

100+ parts

$0.907

1k+ parts

$0.811

10k+ parts

-

3,607

$1.540

$0.907

$0.811

-

Chip1Stop

Japan . 1,740 parts In-Stock

1+ parts

$5.210

100+ parts

$2.180

1k+ parts

$1.400

10k+ parts

-

1,740

$5.210

$2.180

$1.400

-

Rochester

USA . 84,000 parts In-Stock

1+ parts

-

100+ parts

$0.900

1k+ parts

$0.747

10k+ parts

$0.666

84,000

-

$0.900

$0.747

$0.666

Verical

USA . 84,000 parts In-Stock

1+ parts

-

100+ parts

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$0.933

10k+ parts

$0.832

84,000

-

-

$0.933

$0.832

Farnell

UK . 3,946 parts In-Stock

1+ parts

-

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$0.940

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3,946

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-

$0.940

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,098 parts In-Stock

1+ parts

$0.734

100+ parts

-

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-

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1,098

$0.734

-

-

-

Chip Stock

USA . 56,000 parts In-Stock

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56,000

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Flip Electronics

USA . 39,521 parts In-Stock

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39,521

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Vyrian

USA . 3,307 parts In-Stock

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3,307

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Cyclops Electronics Ltd

UK . 2,879 parts In-Stock

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2,879

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,215 parts In-Stock

1+ parts

$0.660

100+ parts

-

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3,215

$0.660

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Semicontronic

India . 2,955 parts In-Stock

1+ parts

$0.660

100+ parts

$0.644

1k+ parts

$0.640

10k+ parts

-

2,955

$0.660

$0.644

$0.640

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Corphita

USA . 501 parts In-Stock

1+ parts

$0.696

100+ parts

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501

$0.696

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Corohmni

South Africa . 145 parts In-Stock

1+ parts

$0.773

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145

$0.773

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Microchip USA

USA . 5,078 parts In-Stock

1+ parts

$4.930

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5,078

$4.930

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Aztec Data Supply Inc.

USA . 3,993 parts In-Stock

1+ parts

$14.390

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3,993

$14.390

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Perfect Parts

USA . 27,068 parts In-Stock

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27,068

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Continental Prestige Electronics

USA . 24,000 parts In-Stock

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$0.880

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24,000

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$0.880

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Lixinc

USA . 11,745 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,913 parts In-Stock

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5,913

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 2,931 parts In-Stock

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Argo Parts USA

USA . 2,884 parts In-Stock

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SupplyDigital Components

Austria . 2,810 parts In-Stock

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TANS Electronics

Latvia . 2,158 parts In-Stock

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Kulean Microsystems

USA . 1,788 parts In-Stock

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1,788

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iodParts Technologies Inc.

India . 947 parts In-Stock

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947

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UHIMA Technologies

Türkiye . 873 parts In-Stock

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873

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Bastille Electronics

Australia . 45 parts In-Stock

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45

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Overview

Unleash the power of efficient and reliable MOSFET gate drivers with the NCP51530BMNTWG by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality products that are perfect for a wide range of applications. This small outline, heat sink package offers customers unparalleled value and benefits with its high side driver capability, automotive-grade temperature grade, and fast turn-on/off times. Elevate your projects with the NCP51530BMNTWG and experience the advantage of superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while ensuring longevity and reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 17 V

With a high maximum supply voltage, this gate driver can handle a wide range of input voltages, making it versatile for different voltage requirements.

Package Shape: SQUARE

The square shape helps in easy and symmetrical placement on the PCB, optimizing space utilization and ensuring a neat and organized circuit layout.

No. of Terminals: 10

Having a sufficient number of terminals provides versatility in connectivity options and allows for connecting to various components within the circuit.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables the gate driver to function effectively in harsh environments or extreme temperatures, ensuring stability and reliability under challenging conditions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the gate driver's performance and longevity, even in demanding high-temperature environments.

Maximum Seated Height: 1 mm

The low seated height allows for compact and slim designs, making it ideal for applications where space is limited or where a sleek form factor is desired.

High Side Driver: YES

Having a high side driver capability simplifies circuit design and allows for efficient control of high-side MOSFETs in various applications.

Nominal Output Peak Current Limit: 3.5 A

The high output peak current limit enables the gate driver to drive power MOSFETs effectively, making it suitable for applications that require high current capabilities.

Technical Specifications

MOSFET Gate Drivers NCP51530BMNTWG attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

3.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.16,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

2.5 mA

Maximum Supply Voltage:

17 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

40 us

Turn-on Time:

40 us

Width:

4 mm

Trade Compliance

NCP51530BMNTWG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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