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NCP45522IMNTWG-L

Onsemi

NCP45522IMNTWG-L by Onsemi

NCP45522IMNTWG-L by Onsemi is a Power Management IC with 3.3V nominal voltage, -40 to 85 °C operating temperature range, and 8 terminals in a small outline package. It is ideal for industrial applications requiring power supply support circuits in compact designs.

Median Price

$0.745

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 31,693 parts In-Stock

1+ parts

-

100+ parts

$0.745

1k+ parts

$0.619

10k+ parts

$0.551

31,693

-

$0.745

$0.619

$0.551

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,991 parts In-Stock

1+ parts

$0.580

100+ parts

-

1k+ parts

-

10k+ parts

-

1,991

$0.580

-

-

-

Vyrian

USA . 8,889 parts In-Stock

1+ parts

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8,889

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Distributors (Availability)

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Corphita

USA . 577 parts In-Stock

1+ parts

$0.550

100+ parts

-

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-

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-

577

$0.550

-

-

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Corohmni

South Africa . 251 parts In-Stock

1+ parts

$0.611

100+ parts

-

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251

$0.611

-

-

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AZTECH Wire

Italy . 892 parts In-Stock

1+ parts

$16.850

100+ parts

-

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892

$16.850

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-

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Component Stockers USA

USA . 403 parts In-Stock

1+ parts

$99.990

100+ parts

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403

$99.990

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TANS Electronics

Latvia . 7,796 parts In-Stock

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7,796

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SupplyDigital Components

Austria . 7,068 parts In-Stock

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7,068

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Problanco Electronics

Mexico . 6,751 parts In-Stock

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6,751

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Kulean Microsystems

USA . 5,991 parts In-Stock

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5,991

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Microchip USA

USA . 1,415 parts In-Stock

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1,415

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UHIMA Technologies

Türkiye . 113 parts In-Stock

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113

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Overview

Discover the NCP45522IMNTWG-L by Onsemi, a cutting-edge Power Management IC that offers unparalleled quality and reliability. Manufactured by industry leader Onsemi, this product provides exceptional performance in a wide range of applications. With its small outline and heat sink profile, this IC is ideal for industrial settings where efficiency is key. Experience the benefits of stable supply voltage, dual terminal position, and matte tin finish for seamless integration into your systems. Trust Onsemi to deliver innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external factors, ensuring reliability and longevity of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a lower nominal supply voltage of 3.3V makes this product energy-efficient and suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85 °C, making it suitable for industrial environments with high thermal loads.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this product is less sensitive to moisture, ensuring reliability during storage and assembly processes.

Technical Specifications

Power Management ICs NCP45522IMNTWG-L attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

NCP45522IMNTWG-L Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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