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NCP2809BDMR2

Onsemi

NCP2809BDMR2 by Onsemi

NCP2809BDMR2 by Onsemi is a small outline audio amplifier with 2.5/5V power supplies, 10 terminals, and dual terminal position. It operates in industrial temperature range (-40 to 85°C) and has a max seated height of 1.1mm. Ideal for applications requiring compact audio amplification in electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 5,908 parts In-Stock

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Digiode

USA . 830 parts In-Stock

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830

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Zilex Electronics Inc.

Canada . 94 parts In-Stock

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AZTECH Wire

Italy . 683 parts In-Stock

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$7.843

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683

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Ampacity Inc.

Singapore . 619 parts In-Stock

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$19.800

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619

$19.800

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A-Z Elektronik GmbH

Germany . 7,349 parts In-Stock

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7,349

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TANS Electronics

Latvia . 4,443 parts In-Stock

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SupplyDigital Components

Austria . 2,778 parts In-Stock

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Kulean Microsystems

USA . 2,411 parts In-Stock

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Problanco Electronics

Mexico . 1,919 parts In-Stock

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Corphita

USA . 1,712 parts In-Stock

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Lixinc

USA . 860 parts In-Stock

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Vigor

Singapore . 732 parts In-Stock

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UHIMA Technologies

Türkiye . 650 parts In-Stock

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Microchip USA

USA . 467 parts In-Stock

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467

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Bastille Electronics

Australia . 300 parts In-Stock

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Corohmni

South Africa . 194 parts In-Stock

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194

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Overview

Enhance your audio experience with the NCP2809BDMR2 by Onsemi, a top-quality audio amplifier designed for various applications in the audio and video industry. Manufactured by Onsemi, known for their superior products, this small outline, thin profile amplifier offers a nominal output power of 0.131W and operates in industrial temperature grades. With its dual terminal position and gull wing terminal form, this amplifier provides customers with efficient performance and reliability. Upgrade your audio system today with the NCP2809BDMR2 and enjoy high-quality sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the amplifier, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation, saving time and effort during setup.

Package Shape: SQUARE

Square package shape helps in easy placement and organization of the amplifier within electronic circuits.

Power Supplies (V): 2.5/5

Support for power supplies ranging from 2.5V to 5V provides flexibility in usage and compatibility with different systems.

Minimum Supply Voltage (Vsup): 2.2 V

Low minimum supply voltage requirement makes this amplifier suitable for energy-efficient applications and power-saving designs.

Nominal Output Power: 0.131 W

Despite its compact size, the amplifier offers a decent nominal output power of 0.131W, ensuring good performance in audio applications.

No. of Channels: 2

Dual-channel support allows for stereo audio output, providing a better listening experience compared to single-channel amplifiers.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance of 85°C ensures stability and reliability even under challenging environmental conditions.

Terminal Finish: Tin/Lead (Sn80Pb20)

Tin/Lead terminal finish enhances connectivity and soldering capability, making installation and maintenance easier for users.

Maximum Supply Current: 3.6 mA

Low maximum supply current requirement helps in reducing power consumption and extending the battery life of portable devices.

Technical Specifications

Audio & Video Amplifiers NCP2809BDMR2 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.131 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3.6 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

NCP2809BDMR2 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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