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NCN6000DTBG

Onsemi

NCN6000DTBG by Onsemi

The Onsemi NCN6000DTBG is a consumer circuit IC with 20 terminals in a small outline, thin profile package. It operates b/w -25 °C to 85°C and supports supply voltages from 2.7V to 6V. Ideal for applications requiring compact design and surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,331 parts In-Stock

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Digiode

USA . 2,138 parts In-Stock

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2,138

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Distributors (Availability)

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AZTECH Wire

Italy . 703 parts In-Stock

1+ parts

$18.200

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703

$18.200

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Problanco Electronics

Mexico . 5,498 parts In-Stock

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5,498

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TANS Electronics

Latvia . 3,928 parts In-Stock

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3,928

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Kulean Microsystems

USA . 3,036 parts In-Stock

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3,036

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Corphita

USA . 2,252 parts In-Stock

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SupplyDigital Components

Austria . 1,662 parts In-Stock

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1,662

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Corohmni

South Africa . 419 parts In-Stock

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UHIMA Technologies

Türkiye . 280 parts In-Stock

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280

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Microchip USA

USA . 200 parts In-Stock

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200

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Overview

Upgrade your consumer electronic devices with the NCN6000DTBG by Onsemi. Crafted with precision and expertise, Onsemi is a trusted manufacturer known for delivering top-quality products that exceed industry standards. This versatile IC offers endless possibilities in various applications, providing seamless functionality and reliable performance. Experience the value and benefits of this cutting-edge technology, designed to enhance your products and elevate user experience. Trust Onsemi to deliver innovation and excellence with every product, making the NCN6000DTBG a must-have for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the product.

Surface Mount: YES

Surface mount technology makes installation and assembly easier and more efficient.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer circuits, making it suitable for a wide range of consumer electronics.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to function well even in elevated temperature environments.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures the product can operate in cold conditions without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance for reliable performance.

Terminal Position: DUAL

Dual terminal position allows for easy and secure connection in the circuit.

Width: 4.4 mm

Compact width makes it suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the product can withstand the reflow soldering process.

Terminal Pitch: 0.65 mm

Close terminal pitch allows for high-density mounting and space-saving on the PCB.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage tolerance allows for flexibility in power input options.

Technical Specifications

Other Function Consumer ICs NCN6000DTBG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NCN6000DTBG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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