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NCN6000DTBR2

Onsemi

NCN6000DTBR2 by Onsemi

The Onsemi NCN6000DTBR2 is a consumer circuit IC with 20 terminals in a small outline, thin profile package. It operates b/w -25 °C to 85°C and supports supply voltages from 2.7V to 6V, drawing a max current of 5mA. Ideal for various consumer electronic applications requiring compact design and surface mount compatibility.

Median Price

$1.770

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$1.770

1k+ parts

$1.580

10k+ parts

$1.490

1

-

$1.770

$1.580

$1.490

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,276 parts In-Stock

1+ parts

$1.881

100+ parts

-

1k+ parts

-

10k+ parts

-

1,276

$1.881

-

-

-

Vyrian

USA . 7,674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,674

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 289 parts In-Stock

1+ parts

$1.782

100+ parts

-

1k+ parts

-

10k+ parts

-

289

$1.782

-

-

-

Corohmni

South Africa . 66 parts In-Stock

1+ parts

$1.980

100+ parts

-

1k+ parts

-

10k+ parts

-

66

$1.980

-

-

-

AZTECH Wire

Italy . 131 parts In-Stock

1+ parts

$10.790

100+ parts

-

1k+ parts

-

10k+ parts

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131

$10.790

-

-

-

Microchip USA

USA . 7,403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,403

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 5,428 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,428

-

-

-

-

GreenTree Electronics

Israel . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,000

-

-

-

-

SupplyDigital Components

Austria . 3,683 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,683

-

-

-

-

TANS Electronics

Latvia . 3,239 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,239

-

-

-

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,500

-

-

-

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Kulean Microsystems

USA . 2,295 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,295

-

-

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Problanco Electronics

Mexico . 2,244 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,244

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RC Electronics

USA . 1,600 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,600

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-

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Kepictronics

USA . 1,520 parts In-Stock

1+ parts

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100+ parts

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1,520

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-

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Assy Fe

Spain . 1,520 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,520

-

-

-

-

UHIMA Technologies

Türkiye . 763 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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763

-

-

-

-

Overview

Discover the cutting-edge technology of the NCN6000DTBR2 by Onsemi, a top-tier manufacturer known for its superior quality and unmatched innovation in consumer ICs. This small outline, thin profile IC offers a wide range of applications, making it a versatile choice for various projects. With a minimum supply voltage of 2.7V and a maximum operating temperature of 85 °C, this IC provides reliable performance in any environment. Experience the value and benefits of the NCN6000DTBR2, designed to enhance your devices with efficiency and precision. Trust Onsemi to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for efficient PCB assembly and space-saving design.

Package Shape: RECTANGULAR

Rectangular package shape is common and easy to work with in circuit designs.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, ensuring compatibility and performance in everyday electronics.

No. of Terminals: 20

Sufficient number of terminals for connectivity and functionality in the circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact size with thin profile and shrink pitch for space-constrained designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature ensures functionality even in colder environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit connections.

Maximum Seated Height: 1.2 mm

Low seated height contributes to a compact and slim design.

Width: 4.4 mm

Narrow width enables space-saving PCB layouts.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement makes the product energy-efficient.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature ensures component reliability during soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for reliable soldering processes.

Length: 6.5 mm

Compact length for space-efficient circuit integration.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and robust mechanical connection.

Maximum Supply Current: 5 mA

Low maximum supply current for efficient power consumption.

Terminal Pitch: 0.65 mm

Fine terminal pitch for high-density board designs.

Maximum Supply Voltage (Vsup): 6 V

Moderate maximum supply voltage capability for versatile applications.

Technical Specifications

Other Function Consumer ICs NCN6000DTBR2 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NCN6000DTBR2 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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